Patents by Inventor Tayuru Yoshida

Tayuru Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6181000
    Abstract: A lead frame for ball grid array which is composed of a plurality of inner leads extending from outside to inside and having terminal ball bumps formed somewhere along them, characterized in that said terminal ball bumps are formed in at least two rows, with adjacent ones not overlapping in the lengthwise direction of the inner lead and said rows holding the bonding area between them. The bonding area may plated according to need. The lead frame can be produced in high yields without reduction in the number of pins. Disclosed also herein are a semiconductor device using said lead frame and a process for producing the same.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: January 30, 2001
    Assignee: Sumitomo Metal Mining Co., Ltd.
    Inventors: Kinya Ooigawa, Tayuru Yoshida, Naoki Nakagawa