Patents by Inventor Te-Chieh Chiu

Te-Chieh Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT DISSIPATING STRUCTURE OF AN INDUSTRIAL COMPUTER
    Publication number: 20090262496
    Abstract: The present invention discloses an improved heat dissipating structure of an industrial computer, and the heat dissipating structure includes a heat dissipating module and two fixing units installed on both lateral sides of a top surface of the heat dissipating module, and the heat dissipating module includes a detachable heat dissipating fan module disposed therein, and the fixing unit is secured integrally with the heat dissipating module and the industrial computer by a plurality of fixing elements to achieve the effect of facilitating the change of a heat dissipating fan module.
    Type: Application
    Filed: April 17, 2008
    Publication date: October 22, 2009
    Applicant: NEXCOM INTERNATIONAL CO., LTD.
    Inventors: Te-Chieh Chiu, Chih-Ming Wu