Patents by Inventor Te-Chieh LI

Te-Chieh LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230348708
    Abstract: The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a polybenzoxazine compound, an anhydride grafted olefin polymer, and a diisocyanate compound; and (B) a thermosetting polymer; wherein, in the toughened and modified compound, the diisocyanate compound forms a bond with the polybenzoxazine compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace, and the like.
    Type: Application
    Filed: December 6, 2022
    Publication date: November 2, 2023
    Inventors: Sheng-Yen WU, Tzu-Fang CHEN, Po-Kai TSENG, Yu-Chieh HSU, Te-Chieh LI, Shao-Wei YU