Patents by Inventor Te-Chih Huang
Te-Chih Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240012340Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.Type: ApplicationFiled: August 7, 2023Publication date: January 11, 2024Inventors: Yu-Ching Lee, Te-Chih Huang, Yu-Piao Fang
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Patent number: 11835864Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.Type: GrantFiled: July 29, 2022Date of Patent: December 5, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yu-Ching Lee, Te-Chih Huang, Yu-Piao Fang
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Patent number: 11624985Abstract: Embodiments of the present disclosure relate to methods for defect inspection. After pattern features are formed in a structure layer, a dummy filling material having dissimilar optical properties from the structure layer is filled in the pattern features. The dissimilar optical properties between materials in the pattern features and the structure layer increase contrast in images captured by an inspection tool, thus increasing the defect capture rate.Type: GrantFiled: October 5, 2020Date of Patent: April 11, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ta-Ching Yu, Shih-Che Wang, Shu-Hao Chang, Yi-Hao Chen, Chen-Yen Kao, Te-Chih Huang, Yuan-Fu Hsu
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Publication number: 20220384358Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.Type: ApplicationFiled: July 29, 2022Publication date: December 1, 2022Inventors: Yu-Ching Lee, Te-Chih Huang, Yu-Piao Fang
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Patent number: 11448975Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.Type: GrantFiled: February 9, 2021Date of Patent: September 20, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yu-Ching Lee, Te-Chih Huang, Yu-Piao Fang
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Patent number: 11320745Abstract: There is disclosed a method of measuring a process parameter for a manufacturing process involving lithography. In a disclosed arrangement the method comprises performing first and second measurements of overlay error in a region on a substrate, and obtaining a measure of the process parameter based on the first and second measurements of overlay error. The first measurement of overlay error is designed to be more sensitive to a perturbation in the process parameter than the second measurement of overlay error by a known amount.Type: GrantFiled: September 4, 2020Date of Patent: May 3, 2022Assignee: ASML Netherlands B.V.Inventors: Maurits Van Der Schaar, Arie Jeffrey Den Boef, Omer Abubaker Omer Adam, Te-Chih Huang, Youping Zhang
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Publication number: 20210270751Abstract: In a method for inspecting pattern defects, a plurality of patterns are formed over an underlying layer. The plurality of patterns are electrically isolated from each other. A part of the plurality of patterns are scanned with an electron beam to charge the plurality of patterns. An intensity of secondary electrons emitted from the scanned part of the plurality of patterns is obtained. One or more of the plurality of patterns that show an intensity of the secondary electrons different from others of the plurality of patterns are searched.Type: ApplicationFiled: October 29, 2020Publication date: September 2, 2021Inventors: Ju-Ying CHEN, Che-Yen LEE, Chia-Fong CHANG, Hua-Tai LIN, Te-Chih HUANG, Chi-Yuan SUN, Jiann Yuan HUANG
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Publication number: 20210165315Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.Type: ApplicationFiled: February 9, 2021Publication date: June 3, 2021Inventors: Yu-Ching Lee, Te-Chih Huang, Yu-Piao Fang
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Patent number: 10915017Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.Type: GrantFiled: July 3, 2018Date of Patent: February 9, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yu-Ching Lee, Te-Chih Huang, Yu-Piao Fang
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Publication number: 20210018848Abstract: Embodiments of the present disclosure relate to methods for defect inspection. After pattern features are formed in a structure layer, a dummy filling material having dissimilar optical properties from the structure layer is filled in the pattern features. The dissimilar optical properties between materials in the pattern features and the structure layer increase contrast in images captured by an inspection tool, thus increasing the defect capture rate.Type: ApplicationFiled: October 5, 2020Publication date: January 21, 2021Inventors: Ta-Ching YU, Shih-Che WANG, Shu-Hao CHANG, Yi-Hao CHEN, Chen-Yen KAO, Te-Chih HUANG, Yuan-Fu HSU
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Publication number: 20200401054Abstract: There is disclosed a method of measuring a process parameter for a manufacturing process involving lithography. In a disclosed arrangement the method comprises performing first and second measurements of overlay error in a region on a substrate, and obtaining a measure of the process parameter based on the first and second measurements of overlay error. The first measurement of overlay error is designed to be more sensitive to a perturbation in the process parameter than the second measurement of overlay error by a known amount.Type: ApplicationFiled: September 4, 2020Publication date: December 24, 2020Applicant: ASML Netherlands B.V.Inventors: Maurits Van Der Schaar, Arie Jeffrey Den Boef, Omer Abubaker Omer Adam, Te-Chih Huang, Youping Zhang
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Patent number: 10795270Abstract: Embodiments of the present disclosure relate to methods for defect inspection. After pattern features are formed in a structure layer, a dummy filling material having dissimilar optical properties from the structure layer is filled in the pattern features. The dissimilar optical properties between materials in the pattern features and the structure layer increase contrast in images captured by an inspection tool, thus increasing the defect capture rate.Type: GrantFiled: December 6, 2017Date of Patent: October 6, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ta-Ching Yu, Shih-Che Wang, Shu-Hao Chang, Yi-Hao Chen, Chen-Yen Kao, Te-Chih Huang, Yuan-Fu Hsu
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Patent number: 10608830Abstract: The disclosure generally relates to power over fiber technology configured to provide electrical power and communications via fiber to one or more sensors of one or more varieties. More particularly, the disclosure relates to a sensor system comprising a laser data module operatively connected to a powered sensor module, wherein the powered sensor module receives a light, converts the light to electrical power, and powers a sensor with the electrical power, and wherein the powered sensor module transmits signals from the sensor to a laser data module.Type: GrantFiled: February 5, 2018Date of Patent: March 31, 2020Assignee: MH GOPOWER COMPANY LIMITEDInventors: Mei-huan Yang, Cheng-liang Wu, Terry Zahuranec, Remigio Perales, Kun-Hsien Chen, Wei-sheng Chao, Ying-lin Tseng, Te-chih Huang, Jheng-syuan Shih, Mu-kai Su
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Publication number: 20190064654Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.Type: ApplicationFiled: July 3, 2018Publication date: February 28, 2019Inventors: Yu-Ching Lee, Te-Chih Huang, Yu-Piao Fang
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Publication number: 20190064675Abstract: Embodiments of the present disclosure relate to methods for defect inspection. After pattern features are formed in a structure layer, a dummy filling material having dissimilar optical properties from the structure layer is filled in the pattern features. The dissimilar optical properties between materials in the pattern features and the structure layer increase contrast in images captured by an inspection tool, thus increasing the defect capture rate.Type: ApplicationFiled: December 6, 2017Publication date: February 28, 2019Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ta-Ching YU, Shih-Che WANG, Shu-Hao CHANG, Yi-Hao CHEN, Chen-Yen KAO, Te-Chih HUANG, Yuan-Fu HSU
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Publication number: 20190018326Abstract: There is disclosed a method of measuring a process parameter for a manufacturing process involving lithography. In a disclosed arrangement the method comprises performing first and second measurements of overlay error in a region on a substrate, and obtaining a measure of the process parameter based on the first and second measurements of overlay error. The first measurement of overlay error is designed to be more sensitive to a perturbation in the process parameter than the second measurement of overlay error by a known amount.Type: ApplicationFiled: September 7, 2018Publication date: January 17, 2019Applicant: ASML Netherlands B.V.Inventors: Maurits Van Der Schaar, Arie Jeffrey Den Boef, Omer Abubaker Omer Adam, Te-Chih Huang, Youping Zhang
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Patent number: 10180628Abstract: A method of determining a critical-dimension-related property, such as critical dimension (CD) or exposure dose, includes illuminating each of a plurality of periodic targets having different respective critical dimension biases, measuring intensity of radiation scattered by the targets, recognizing and extracting each grating from the image, determining a differential signal, and determining the CD-related property based on the differential signal, the CD biases and knowledge that the differential signal approximates to zero at a 1:1 line-to-space ratio of such periodic targets. Use of the determined CD-related property to control a lithography apparatus in lithographic processing of subsequent substrates. In order to use just two CD biases, a calibration may use measurements on a “golden wafer” (i.e. a reference substrate) to determine the intensity gradient for each of the CD pairs, with known CDs. Alternatively, the calibration can be based upon simulation of the sensitivity of intensity gradient to CD.Type: GrantFiled: May 23, 2014Date of Patent: January 15, 2019Assignee: ASML Netherlands B.V.Inventors: Hugo Augustinus Joseph Cramer, Arie Jeffrey Den Boef, Henricus Johannes Lambertus Megens, Maurits Van Der Schaar, Te-Chih Huang
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Patent number: 10162272Abstract: A substrate has a plurality of overlay gratings formed thereon by a lithographic process. Each overlay grating has a known overlay bias. The values of overlay bias include for example two values in a region centered on zero and two values in a region centered on P/2, where P is the pitch of the gratings. Overlay is calculated from asymmetry measurements for the gratings using knowledge of the different overlay bias values, each of the overall asymmetry measurements being weighted by a corresponding weight factor. Each one of the weight factors represents a measure of feature asymmetry within the respective overlay grating. The calculation is used to improve subsequent performance of the measurement process, and/or the lithographic process. Some of the asymmetry measurements may additionally be weighted by a second weight factor in order to eliminate or reduce the contribution of phase asymmetry to the overlay.Type: GrantFiled: August 18, 2016Date of Patent: December 25, 2018Assignee: ASML Netherlands B.V.Inventors: Martin Jacobus Johan Jak, Hendrik Jan Hidde Smilde, Te-Chih Huang, Victor Emanuel Calado, Henricus Wilhelmus Maria Van Buel, Richard Johannes Franciscus Van Haren
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Patent number: 10073357Abstract: There is disclosed a method of measuring a process parameter for a manufacturing process involving lithography. In a disclosed arrangement the method comprises performing first and second measurements of overlay error in a region on a substrate, and obtaining a measure of the process parameter based on the first and second measurements of overlay error. The first measurement of overlay error is designed to be more sensitive to a perturbation in the process parameter than the second measurement of overlay error by a known amount.Type: GrantFiled: January 28, 2015Date of Patent: September 11, 2018Assignee: ASML Netherlands B.V.Inventors: Maurits Van Der Schaar, Arie Jeffrey Den Boef, Omer Abubaker Omer Adam, Te-Chih Huang, Youping Zhang
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Publication number: 20180227133Abstract: The disclosure generally relates to power over fiber technology configured to provide electrical power and communications via fiber to one or more sensors of one or more varieties. More particularly, the disclosure relates to a sensor system comprising a laser data module operatively connected to a powered sensor module, wherein the powered sensor module receives a light, converts the light to electrical power, and powers a sensor with the electrical power, and wherein the powered sensor module transmits signals from the sensor to a laser data module.Type: ApplicationFiled: February 5, 2018Publication date: August 9, 2018Inventors: Mei-huan Yang, Cheng-liang Wu, Terry Zahuranec, Remigio Perales, Kun-Hsien Chen, Wei-sheng Chao, Ying-lin Tseng, Te-chih Huang, Jheng-syuan Shih, Mu-kai Su