Patents by Inventor Te-Chih Tseng

Te-Chih Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10333257
    Abstract: The present invention provides a signal connector having grounding terminals and ground piece together to form a grounding element, which includes a first terminal assembly, a second terminal assembly, and a ground piece inserted in an insulating base body and located between the first and second terminal assemblies; wherein, two metal plates are inserted in the insulating base body and in contact with the ground piece respectively with the top portions thereof exposed outside the top surface of the insulating base body to serve as first grounding terminals of the first terminal assembly, and the bottom portions of the two metal plates exposed outside the bottom surface of the insulating base body to serve as second grounding terminals of the second terminal assembly. The first and second grounding terminals, and the ground piece are able to form the grounding element together for providing a shielding effect.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: June 25, 2019
    Assignee: SIMULA TECHNOLOGY INC.
    Inventor: Te-Chih Tseng
  • Patent number: 10218128
    Abstract: The present invention discloses a signal connector having terminals in contact with a ground piece by means of a bending portion, comprising an insulating base body, a first terminal assembly, a second terminal assembly and a ground piece. The terminal assemblies are inserted on to the insulating base body at locations adjacent to the top and bottom portions thereof, respectively; the ground piece is inserted in the gap of the insulating base body corresponding to the location between terminal assemblies. The outermost positions of both sides of terminal assemblies act as a grounding terminal respectively. Features of the signal connector include: a bending portion is formed at the peripheral of the ground piece or each front end of grounding terminals, respectively. Each bending portion connects the corresponding grounding terminal with the ground piece electrically to create a complete shielding effect and interference prevention of high frequency signals between terminal assemblies.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: February 26, 2019
    Assignee: SIMULA TECHNOLOGY INC.
    Inventor: Te-Chih Tseng
  • Publication number: 20180366884
    Abstract: The present invention provides a signal connector having grounding terminals and ground piece together to form a grounding element, which includes a first terminal assembly, a second terminal assembly, and a ground piece inserted in an insulating base body and located between the first and second terminal assemblies; wherein, two metal plates are inserted in the insulating base body and in contact with the ground piece respectively with the top portions thereof exposed outside the top surface of the insulating base body to serve as first grounding terminals of the first terminal assembly, and the bottom portions of the two metal plates exposed outside the bottom surface of the insulating base body to serve as second grounding terminals of the second terminal assembly. The first and second grounding terminals, and the ground piece are able to form the grounding element together for providing a shielding effect.
    Type: Application
    Filed: September 25, 2017
    Publication date: December 20, 2018
    Applicant: SIMULA TECHNOLOGY INC.
    Inventor: Te-Chih Tseng
  • Publication number: 20180366882
    Abstract: The present invention discloses a signal connector having terminals in contact with a ground piece by means of a bending portion, comprising an insulating base body, a first terminal assembly, a second terminal assembly and a ground piece. The terminal assemblies are inserted on to the insulating base body at locations adjacent to the top and bottom portions thereof, respectively; the ground piece is inserted in the gap of the insulating base body corresponding to the location between terminal assemblies. The outermost positions of both sides of terminal assemblies act as a grounding terminal respectively. Features of the signal connector include: a bending portion is formed at the peripheral of the ground piece or each front end of grounding terminals, respectively. Each bending portion connects the corresponding grounding terminal with the ground piece electrically to create a complete shielding effect and interference prevention of high frequency signals between terminal assemblies.
    Type: Application
    Filed: November 7, 2017
    Publication date: December 20, 2018
    Applicant: SIMULA TECHNOLOGY INC.
    Inventor: Te-Chih TSENG
  • Patent number: 10069247
    Abstract: A connector capable of reducing signal interference between two rows of terminals by grounding pin of a grounding plate includes an insulating base, first terminals, second terminals, and the grounding plate; wherein the first and second terminals are embedded in the insulating base and are adjacent to its top and bottom respectively; and the grounding plate is embedded in the insulating base and lies between the first and second terminals. The connector is characterized in that the soldering portions of the second terminals as well as the first terminals are arranged horizontally and soldered to a circuit board; that the circuit board forms a separation area between the two rows of terminals; and that the grounding plate includes at least one grounding pin soldered to, and adjacent to the center of, the separation area to produce a shielding effect, and thereby prevent signal interference, between the two rows of terminals.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: September 4, 2018
    Assignee: SIMULA TECHNOLOGY INC.
    Inventor: Te-Chih Tseng
  • Patent number: 9907187
    Abstract: A PCB with two rows of solder pads including both SMT-based and DIP-based structures is configured to be mounted with a USB Type-C connector by soldering, has two rows of solder pads on its top side, and is characterized in that at least one solder pad in one of the rows is a DIP-based structure while the remaining solder pads in the same row are SMT-based structures, and that all the solder pads in each row that are used to transmit high-frequency signals are SMT-based structures. Once the connector is mounted to the PCB, an inspector can directly examine the soldering quality of the DIP-based-structure solder pad and of the corresponding connection terminal simply by inspecting the bottom side of the PCB. Moreover, since all the solder pads configured for transmitting high-frequency signals are SMT-based structures, better transmission will be provided to the connector, accordingly.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: February 27, 2018
    Assignee: SIMULA TECHNOLOGY INC.
    Inventor: Te-Chih Tseng
  • Patent number: 9281642
    Abstract: The present disclosure is to provide a connector which is compatible to USB Type-C standard and includes an assembly tongue plate, two grounding boards and a metal casing. The assembly tongue plate includes a first terminal block made of plastic and having a plurality of first connection terminals disposed therein, a second terminal block made of plastic and having a plurality of second connection terminals disposed therein, and a metal separating plate being assembled between a bottom surface of the first terminal block and a top surface of the second terminal block. The two grounding boards can be fastened with each other to enclose outer edges of the first terminal block and second terminal block when the metal separating plate is assembled between the first terminal block and second terminal block, so as for allowing the assembly tongue plate to be easily and quickly assembled into the metal casing.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: March 8, 2016
    Assignee: SIMULA TECHNOLOGY INC.
    Inventor: Te-Chih Tseng
  • Patent number: 9281643
    Abstract: The present invention is to provide a connector having a metal separating plate being fastened by a tongue plate in integral formation, which is compatible to USB Type-C standard and includes a tongue plate made of plastic integrally and provided with a metal separating plate fixedly disposed therein; a plurality of first connection terminals respectively inserted into first connection slots formed in the tongue plate near a top surface of the metal separating plate; a plurality of second connection terminals respectively inserted into second connection slots formed in the tongue plate near a bottom surface of the metal separating plate; grounding boards having structures respectively matched with the tongue plate, so as to enclose an outer edge of the tongue plate; and a metal casing having a structure matching with the tongue plate, so as to allow the tongue plate and grounding boards to be assembled into the metal casing.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: March 8, 2016
    Assignee: SIMULA TECHNOLOGY INC.
    Inventor: Te-Chih Tseng
  • Patent number: D811347
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: February 27, 2018
    Assignees: SIMULA TECHNOLOGY INC., ASCOM (SWEDEN) AB
    Inventor: Te-Chih Tseng