Patents by Inventor Te Chun Chen

Te Chun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for separating defective dies from wafer
    Patent number: 8311666
    Abstract: A system separating defective dies from a wafer comprises a film frame platform and a pick-and-place device. The film frame platform comprises a support table assembly configured for supporting a film frame assembly and a platform surface configured to receive the placement of bins thereupon. The pick-and-place device is configured for moving in a linear manner between the support table assembly and the platform surface.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: November 13, 2012
    Assignee: Cheng Mei Instrument Technology Co., Ltd.
    Inventors: Te Chun Chen, Chien Chao Huang, Cheng Tao Tsai
  • SYSTEM AND METHOD FOR SEPARATING DEFECTIVE DIES FROM WAFER
    Publication number: 20100166535
    Abstract: A system separating defective dies from a wafer comprises a film frame platform and a pick-and-place device. The film frame platform comprises a support table assembly configured for supporting a film frame assembly and a platform surface configured to receive the placement of bins thereupon. The pick-and-place device is configured for moving in a linear manner between the support table assembly and the platform surface.
    Type: Application
    Filed: December 28, 2009
    Publication date: July 1, 2010
    Applicant: CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.
    Inventors: TE CHUN CHEN, CHIEN CHAO HUANG, CHENG TAO TSAI