Abstract: An integrated circuit device includes a gate stack disposed over a substrate. A first L-shaped spacer is disposed along a first sidewall of the gate stack and a second L-shaped spacer is disposed along a second sidewall of the gate stack. The first L-shaped spacer and the second L-shaped spacer include silicon and carbon. A first source/drain epitaxy region and a second source/drain epitaxy region are disposed over the substrate. The gate stack is disposed between the first source/drain epitaxy region and the second source/drain epitaxy region. An interlevel dielectric (ILD) layer disposed over the substrate. The ILD layer is disposed between the first source/drain epitaxy region and a portion of the first L-shaped spacer disposed along the first sidewall of the gate stack and between the second source/drain epitaxy region and a portion of the second L-shaped spacer disposed along the second sidewall of the gate stack.

Abstract: A light-emitting diode device including a pixel structure including first, second and third light-emitting diode chips, a passivation layer, and first, second, third and fourth circuit layers is provided. The first and second light-emitting diode chips are positioned on a top surface opposite to a light-emitting surface of the third light-emitting diode chip. First and second vertical projections of the first and second light-emitting diode chips on the top surface do not overlap each other. First and second bonding surfaces of the first and second circuit layers corresponding to openings in the passivation layer are positioned to overlap the first vertical projection and are separated from the second vertical projection. Third and fourth bonding surfaces of the third and fourth circuit layers that correspond to openings in the passivation layer are positioned to overlap the second vertical projection and are separated from the first vertical projection.

Abstract: A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.

Abstract: A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.

Abstract: A light-emitting element includes a first reflection layer, a second reflection layer, a multi-layer light-emitting structure, and a light-transmitting semiconductor layer. The first reflection layer has a first reflectance, and the second reflection layer has a second reflectance greater than the first reflectance. The multi-layer light-emitting structure is between the first reflection layer and the second reflection layer. The light-transmitting semiconductor layer is located on the first reflection layer and has an upper light-extracting surface, and the first reflection layer is closer to the upper light-extracting surface than the second reflection layer. An interval between the upper light-extracting surface and the first reflection layer is equal to or smaller than 5 ?m.

Abstract: A light-emitting diode structure includes a light-emitting part and a reflective part. The light-emitting part has a light-emitting surface. The reflective part is on the light-emitting part opposite to the light-emitting surface. The reflective part is a gradient distributed Bragg reflection structure and includes a plurality of first dielectric layers and a plurality of second dielectric layers. The second dielectric layers have a refractive index different from that of the first dielectric layer, and are alternately stacked with the first dielectric layers. Each of the first dielectric layers has a different optical thickness, and each of the second dielectric layers has a different optical thickness. The optical thicknesses of the first dielectric layers and the second dielectric layers vary in a gradient way away from the light-emitting part.

Abstract: A tray-type fan impeller structure includes a plate body annularly disposed around a hub. The plate body has a connection side connected with the hub and a free side extending in a direction away from the hub. Multiple boss bodies are arranged on a top face or the top face and a bottom face of the plate body at intervals. By means of the boss bodies, the periodical noise problem caused by the conventional blades is improved.

Abstract: A disk-shaped fan impeller structure includes a plate body having an inner rim and an outer rim. The inner rim is connected with a hub via multiple connection members. The outer rim extends in a direction away from the hub. The connection members are annularly disposed on outer circumference of the hub at intervals to radially extend toward the inner rim of the plate body. A top face and a bottom face are defined between the inner rim and outer rim. Multiple upper boss bodies are arranged on the top face at intervals. Multiple first gaps are distributed between the upper boss bodies. By means of the boss bodies, the periodical noise problem of the conventional fan impeller can be improved.

Abstract: A light emitting diode includes a first type semiconductor layer, an active layer, a second type semiconductor layer, a patterned electrode layer, a flat layer and a reflective layer. The active layer is disposed on the first type semiconductor layer. The second type semiconductor layer is disposed on the active layer. The second type semiconductor layer includes a first surface and a second surface having a first arithmetic mean roughness. The patterned electrode layer is disposed on the second surface of the second type semiconductor layer. The planarization layer is disposed on the second type semiconductor layer. The planarization layer includes a third surface and a fourth surface. The third surface is in contact with the second surface of the second type semiconductor layer. The fourth surface has a second arithmetic mean roughness that is less than the first arithmetic mean roughness.

Abstract: A fan blade with improved structure includes a hub, a plurality of blades. The hub has a lateral side having two ends, one of which is formed a top side and the other end is extended to form an extended section, and a plurality of connecting slots located on the periphery of the extended section. Each blade has a first end correspondingly engaged in respective connecting slot and a second end. With these arrangements, the fan blade with improved structure can increase structural strength of thin fan blades and be easy to connect the hub to the blades.

Abstract: A pressproof fan structure includes: a fan frame having an upper case and a lower case; a support shaft having one end inserted into the lower case, and the other end protruding out from the upper case; an oil-retaining bearing having a bearing hole, in which the support shaft is fitted; a rotor assembly fitted around and connected with the oil-retaining bearing; a restriction member fitted around the support shaft near the oil-retaining bearing; a thrust member fitted around the support shaft near the oil-retaining bearing; and a stator assembly disposed on the lower case near the oil-retaining bearing without contacting.

Abstract: An anti-press fan structure includes a fan frame and a fan impeller. The fan impeller has a support shaft supporting the fan impeller disposed in the fan frame. The support shaft has a protrusion section protruding from the fan frame to bear and connect with an external unit positioned above the fan impeller so as to keep an axial space between the fan impeller and the external unit. Accordingly, the fan impeller is prevented from being compressed by the external unit and the pressure applied to the fan frame is dispersed.

Abstract: A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.

Abstract: A disk-shaped fan impeller structure includes a plate body having an inner rim and an outer rim. The inner rim is connected with a hub via multiple connection members. The outer rim extends in a direction away from the hub. The connection members are annularly disposed on outer circumference of the hub at intervals to radially extend toward the inner rim of the plate body. A top face and a bottom face are defined between the inner rim and outer rim. Multiple upper boss bodies are arranged on the top face at intervals. Multiple first gaps are distributed between the upper boss bodies. By means of the boss bodies, the periodical noise problem of the conventional fan impeller can be improved.

Abstract: A tray-type fan impeller structure includes a plate body annularly disposed around a hub. The plate body has a connection side connected with the hub and a free side extending in a direction away from the hub. Multiple boss bodies are arranged on a top face or the top face and a bottom face of the plate body at intervals. By means of the boss bodies, the periodical noise problem caused by the conventional blades is improved.

Abstract: A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.

Abstract: An anti-press fan structure includes a fan frame and a fan impeller. The fan impeller has a support shaft supporting the fan impeller disposed in the fan frame. The support shaft has a protrusion section protruding from the fan frame to bear and connect with an external unit positioned above the fan impeller so as to keep an axial space between the fan impeller and the external unit. Accordingly, the fan impeller is prevented from being compressed by the external unit and the pressure applied to the fan frame is dispersed.

Abstract: A pressproof fan structure includes: a fan frame having an upper case and a lower case; a support shaft having one end inserted into the lower case, and the other end protruding out from the upper case; an oil-retaining bearing having a bearing hole, in which the support shaft is fitted; a rotor assembly fitted around and connected with the oil-retaining bearing; a restriction member fitted around the support shaft near the oil-retaining bearing; a thrust member fitted around the support shaft near the oil-retaining bearing; and a stator assembly disposed on the lower case near the oil-retaining bearing without contacting.

Abstract: A fan wheel structure includes a hub provided with a plate member and a plurality of blades. The plate member is located around the hub and has an upper side and a lower side. The blades are arranged on the upper side of the plate member and respectively have a connecting end connected to the hub as well as a free end. The blades respectively include a backward-curved section, a middle section and a forward-curved section. The backward-curved section is located adjacent to the connecting end and connected to the upper side of the plate member; the forward-curved section is located adjacent to the free end; and the middle section is connected at two opposite ends to the backward-curved section and the forward-curved section. And, an air passage is formed on the upper side of the plate member between any two adjacent backward-curved sections.

Abstract: A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.