Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.

Abstract: An electronic device is provided. The electronic device includes a redistribution structure, an electronic unit and a first conductive pad. The first conductive pad is disposed between the redistribution structure and the electronic unit. The electronic unit is electrically connected to the redistribution structure through the first conductive pad. The first conductive pad has a first coefficient of thermal expansion and a first Young's modulus. The first coefficient of thermal expansion and the first Young's modulus conform to the following formula: 0.7×(0.0069E2?1.1498E+59.661)?CTE?1.3×(0.0069E2?1.1498E+59.661), wherein CTE is the first coefficient of thermal expansion, and E is the first Young's modulus in the formula.

Abstract: A semiconductor device includes a first region and a second region, and the second region surrounds the first region. The semiconductor device includes at least one electronic unit, a redistribution structure, a plurality of first pads, and a plurality of second pads. The redistribution structure may be electrically connected to at least one electronic unit. A plurality of first pads are arranged on the redistribution structure and correspondingly to the first region. There is a first pitch between two adjacent first pads. A plurality of second pads are arranged on the redistribution structure and correspondingly to the second region. There is a second pitch between two adjacent second pads, so that the first pitch is smaller than the second pitch.

Abstract: An all-terrain vehicle is provided. The all-terrain vehicle includes a vehicle frame unit. A steering mechanism is rotatably mounted to a front side of the vehicle frame unit. Front wheels are rotatable mounted to a lower side of the steering mechanism as being arranged pairwise as a left-side one and a right-side one and are controllable by the steering mechanism. The all-terrain vehicle includes a vehicle cover unit covering a periphery of the vehicle frame unit. The vehicle cover unit includes a front vehicle cover section. An open receiving space is formed between a top side of the front wheels and the front vehicle cover section. An inertial sensor is arranged in the open receiving space. As such, mounting and servicing the inertial sensor can be carried out without removing the front vehicle cover section or other parts, and thus, mounting and servicing of the inertial sensor is made easy.

Abstract: An all-terrain vehicle is provided. The all-terrain vehicle includes a vehicle frame unit. A steering mechanism is rotatably mounted to a front side of the vehicle frame unit. Front wheels are rotatable mounted to a lower side of the steering mechanism as being arranged pairwise as a left-side one and a right-side one and are controllable by the steering mechanism. The all-terrain vehicle includes a vehicle cover unit covering a periphery of the vehicle frame unit. The vehicle cover unit includes a front vehicle cover section. An open receiving space is formed between a top side of the front wheels and the front vehicle cover section. An inertial sensor is arranged in the open receiving space. As such, mounting and servicing the inertial sensor can be carried out without removing the front vehicle cover section or other parts, and thus, mounting and servicing of the inertial sensor is made easy.

Abstract: A device for controlling power to a vehicular differential speed controller is applied to control a differential speed controller inside a vehicle, and has an input voltage regulation circuit, a trigger circuit, a driving circuit and a relay. The input voltage regulation circuit converts an input voltage into an operating voltage and supplies the operating voltage to the trigger circuit. The trigger circuit generates a trigger signal after receiving a parking brake signal, such that the driving circuit activates the relay according to the trigger signal and supplies an output voltage to the differential speed controller. Accordingly, the present invention can automatically provide a sufficient power supply time to the differential speed controller to switch an operation state of a vehicle differential to a locked state when the vehicle power is switched off and the parking brake is activated.

Abstract: A device for controlling power to a vehicular differential speed controller is applied to control a differential speed controller inside a vehicle, and has an input voltage regulation circuit, a trigger circuit, a driving circuit and a relay. The input voltage regulation circuit converts an input voltage into an operating voltage and supplies the operating voltage to the trigger circuit. The trigger circuit generates a trigger signal after receiving a parking brake signal, such that the driving circuit activates the relay according to the trigger signal and supplies an output voltage to the differential speed controller. Accordingly, the present invention can automatically provide a sufficient power supply time to the differential speed controller to switch an operation state of a vehicle differential to a locked state when the vehicle power is switched off and the parking brake is activated.

Abstract: A handle-mounted parking brake device includes a parking brake lever movable between a first position, where a brake unit is disposed at a non-braking position for permitting rotation of a wheel axle of a vehicle, and a second position, where the brake unit is disposed at a braking position, and a cutoff switch having a mechanical switch body displaceable with movement of the parking brake lever between switch-on and switch-off positions, where a condenser discharge ignition is powered by and cut off from a DC power supply, respectively. Premature activation of a starter motor can be avoided to ensure cutoff of an engine when the vehicle is in a parking brake state so as to reliably prevent inadvertent operation to drive the vehicle.