Patents by Inventor Te-Hai Tseng

Te-Hai Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8310615
    Abstract: A backlight module which includes a frame and a first prism film is provided. The frame includes sidewall which encloses an inner space. The first prism film is disposed within the inner space and has a plurality of prisms on it. The prisms are in parallel and adjacent to each other, and the prisms extend along a first extending direction. The first prism film has a surrounding edge, which includes a first edge and a second edge. The prisms include a center prism being substantially located in a center position of all prisms. The center prism insects the surrounding edge at two intersection points; a first distance D1 is between the intersection point and the sidewall. The surrounding edge further has an end point being located farthest from the center prism. A second distance D2 is between the end point and the sidewall. The first distance D1 is larger than the second distance D2.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: November 13, 2012
    Assignee: Au Optronics Corporation
    Inventors: Chi-Hung Chang, Te-Hai Tseng, Cheng-Wei Li, Ching-Sang Yang
  • Patent number: 7999904
    Abstract: A flat display panel includes a first substrate and a second substrate adhered to the first substrate. The first substrate has a display region, and a peripheral region located on at least one side of the first substrate. The peripheral region includes a driving IC connection region. The second substrate has a main region corresponding to and covering the display region of the first substrate, and at least one extension region protruding from the main region and covering a portion of the peripheral region.
    Type: Grant
    Filed: May 14, 2007
    Date of Patent: August 16, 2011
    Assignee: AU Optronics Corp.
    Inventors: Te-Hai Tseng, Wei-Li Chen
  • Publication number: 20110157869
    Abstract: A backlight module which includes a frame and a first prism film is provided. The frame includes sidewall which encloses an inner space. The first prism film is disposed within the inner space and has a plurality of prisms on it. The prisms are in parallel and adjacent to each other, and the prisms extend along a first extending direction. The first prism film has a surrounding edge, which includes a first edge and a second edge. The prisms include a center prism being substantially located in a center position of all prisms. The center prism insects the surrounding edge at two intersection points; a first distance D1 is between the intersection point and the sidewall. The surrounding edge further has an end point being located farthest from the center prism. A second distance D2 is between the end point and the sidewall. The first distance D1 is larger than the second distance D2.
    Type: Application
    Filed: November 30, 2010
    Publication date: June 30, 2011
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Chi-Hung Chang, Te-Hai Tseng, Cheng-Wei Li, Ching-Sang Yang
  • Publication number: 20080158467
    Abstract: A flat display panel includes a first substrate and a second substrate adhered to the first substrate. The first substrate has a display region, and a peripheral region located on at least one side of the first substrate. The peripheral region includes a driving IC connection region. The second substrate has a main region corresponding to and covering the display region of the first substrate, and at least one extension region protruding from the main region and covering a portion of the peripheral region.
    Type: Application
    Filed: May 14, 2007
    Publication date: July 3, 2008
    Inventors: Te-Hai Tseng, Wei-Li Chen
  • Publication number: 20070272590
    Abstract: A packaging structure is provided. The packaging structure is used to package at least two semiconductor elements. The packaging structure includes a flexible film. The flexible film has a contacting surface. The at least two semiconductor elements are placed on the contacting surface. The contacting surface has slight stickiness such that the positions of the at least two semiconductor elements relative to the contacting surface can be held.
    Type: Application
    Filed: October 19, 2006
    Publication date: November 29, 2007
    Applicant: AU OPTRONICS CORP.
    Inventors: Te-Hai Tseng, Jin-Shr Huang
  • Publication number: 20070030699
    Abstract: The present invention provides a backlight module structure. The backlight module structure comprises a frame integral with a light guide plate, a shielding tape and a reflector. An extended portion of the shielding tape or an extended portion of the reflector is used to cover a feed point of a light guide molding material. This structure of the backlight module prevents production of a dark area, and makes the light to be utilized more effectively.
    Type: Application
    Filed: October 21, 2005
    Publication date: February 8, 2007
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Te-Hai Tseng, Kuang-Tao Sung, Hung-Chih Chen