Abstract: A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.

Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

Abstract: A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.

Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh is passed out from the opening to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

Abstract: A heat dissipation device applied to a heat source includes a heat conduction unit and a power generation unit. A fluid chamber and a rotor chamber are configured inside the heat conduction unit. The fluid chamber and the rotor chamber are communicated with each other. A working fluid is configured in the fluid chamber. The power generation unit has a rotor and a power generation module. The rotor is connected to the power generation module and is configured in the rotor chamber. The rotor is driven by the working fluid so as to enable the power generation unit to output electrical energy. An electronic system with the heat dissipation device is also disclosed.

Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh is passed out from the opening to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

Abstract: A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.

Abstract: A heat dissipation device applied to a heat source includes a heat conduction unit and a power generation unit. A fluid chamber and a rotor chamber are configured inside the heat conduction unit. The fluid chamber and the rotor chamber are communicated with each other. A working fluid is configured in the fluid chamber. The power generation unit has a rotor and a power generation module. The rotor is connected to the power generation module and is configured in the rotor chamber. The rotor is driven by the working fluid so as to enable the power generation unit to output electrical energy. An electronic system with the heat dissipation device is also disclosed.

Abstract: A vapor chamber includes a first metal cover plate and a second metal cover plate. The first metal cover plate has a plurality of first support portions, each of the first support portions has a head portion and a neck portion, and the head portion is extended from the neck portion. The second metal cover plate has a plurality of second support portions, each of the second support portions has a through hole and an engaging recess, and the engaging recess is formed in the through hole. The head portion is disposed in the engaging recess and the neck portion is disposed in the through hole, such that the first support portion and the second support portion are engaged with each other.

Abstract: A shell structure for handheld device includes at least a portion of vapor chamber. The vapor chamber is formed with a heat absorbing portion and a heat dissipating portion. The vapor chamber is vacuumed and filled with fluid. A plurality of capillaries is formed in the vapor chamber. The heat from the handheld device is emitted rapidly by traveling through the vapor chamber without occupying the interior space of the handheld device.

Abstract: A plate-type heat pipe includes a first main body, a capillary structure and a support structure. The first main body has a first face and a second face. The capillary structure is disposed on the first face and the support structure is disposed on the side of the capillary structure opposite to the first main body. When pressing the first main body, capillary structure and support structure, the layers are tightly connected.

Abstract: A plate-type heat pipe includes a first plate, a capillary structure and a support structure. The first plate, the capillary structure and the support structure are arranged in sequence, and the first plate, the capillary structure and the support structure are tightly connected by pressing. A method of manufacturing a plate-type heat pipe is also discussed.

Abstract: A heat pipe with a flexible support structure includes a pipe body and a support, and the support is installed in the pipe body and includes a first row of side plates and a second row of side plates extended along the lengthwise direction of the pipe body and a plurality of support elements coupled between the first and second rows of side plates, and each support element abuts the internal side of a capillary tissue of the pipe body. Plate elements of the first and second rows of side plates are arranged with an interval apart from each other and in sections along the lengthwise direction of the pipe body, and the plate elements of the first row of side plates and the plate elements of the second row of side plates are aligned alternately with each other. The support is flexible to facilitate users to bend the heat pipe.

Abstract: A flat heat pipe with a capillary structure includes a pipe body and a capillary tissue. The pipe body is substantially hollow and flat and includes a bottom wall and a top wall opposite to the bottom wall, and both walls are formed on the pipe body, and an appropriate quantity of working fluid is sealed inside the pipe body. The capillary tissue is covered onto an internal side of the bottom wall, and the capillary tissue includes a plurality of protrusions formed inside the pipe body and extended along the lengthwise direction of the pipe body, and a gap is reserved between the protrusions and the internal side of the top wall to form an air passage. The protrusions formed by the capillary tissue can provide sufficient capillary forces and also produce the gap to form the air passage.

Abstract: The vapor chamber includes a casing, wick structure, working fluid and filling/degassing tube. The casing is composed of two plates and has a chamber therein. The wick structure and working fluid are disposed in the chamber. The filling/degassing tube is connected with the casing to form a passage communicating with the chamber. A portion of the plates which overlaps the filling/degassing tube is pressed to deform for making the passage closed. And the outer end of the filling/degassing tube is flush with the side of the casing.

Abstract: The present invention provides a flat-type heat pipe and a wick structure thereof. The flat-type heat pipe has a flat tube. The wick structure is arranged inside the flat tube along an axial line of the flat tube. The wick structure comprises a first wick portion and two second wick portions connected on both sides of the first wick portion. The thickness of the first wick portion is larger than that of the second wick portion. The first wick portion abuts against an upper inner wall of the flat tube. An air channel is formed between each of the second wick portions and the upper inner wall of the flat tube. The wick structure supports the inner wall of the flat-type heat pipe without providing additional supporting structure, so that the heat pipe can be made more compact.

Abstract: A vapor chamber having a composite supporting structure includes a flat sealed casing; a wick structure, a working fluid and a composite supporting structure. The composite supporting structure has a waved supporting rack and at least one supporting pillar. The waved supporting rack is configured to support upper and lower inner walls of the flat sealed casing. The waved supporting rack has plural separated channels for allowing vapor of the working fluid to flow through. Both ends of the at least one supporting pillar are respectively connected to the flat sealed casing or the wick structure. With this arrangement, compressive strength and tensile strength of the vapor chamber can be increased simultaneously without obstructing the circulation of liquid/vapor phases of the working fluid and reducing the thermal-conducting efficiency thereof.