Abstract: An electronic device is provided. The electronic device includes a redistribution structure, an electronic unit and a first conductive pad. The first conductive pad is disposed between the redistribution structure and the electronic unit. The electronic unit is electrically connected to the redistribution structure through the first conductive pad. The first conductive pad has a first coefficient of thermal expansion and a first Young's modulus. The first coefficient of thermal expansion and the first Young's modulus conform to the following formula: 0.7×(0.0069E2?1.1498E+59.661)?CTE?1.3×(0.0069E2?1.1498E+59.661), wherein CTE is the first coefficient of thermal expansion, and E is the first Young's modulus in the formula.

Abstract: A semiconductor device includes a first region and a second region, and the second region surrounds the first region. The semiconductor device includes at least one electronic unit, a redistribution structure, a plurality of first pads, and a plurality of second pads. The redistribution structure may be electrically connected to at least one electronic unit. A plurality of first pads are arranged on the redistribution structure and correspondingly to the first region. There is a first pitch between two adjacent first pads. A plurality of second pads are arranged on the redistribution structure and correspondingly to the second region. There is a second pitch between two adjacent second pads, so that the first pitch is smaller than the second pitch.

Abstract: Provided are a circuit apparatus, a manufacturing method thereof, and a circuit system. The circuit apparatus includes a flexible circuit board, a flexible packaging material layer and an electronic device. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic device is disposed on the first surface of the flexible circuit board and electrically connected with the flexible circuit board.

Abstract: Disclosed is an optical head, including a hollow micro-pipe and a stuffing member, the micro-pipe having a diameter-extended portion and a diameter-diminishing portion adapted allowing the incident light to transmit from the diameter-extended portion to the diameter-diminishing portion to emerge from its tip, and the stuffing member being disposed inside of the micro-pipe compared to prior techniques. The optical head of the invention is easier to be made, and it has a better focus for achieving optical exposure of sub-wave length focal spot and deep depth of focus.

Abstract: Disclosed is an optical head, including a hollow micro-pipe and a stuffing member, the micro-pipe having a diameter-extended portion and a diameter-diminishing portion adapted allowing the incident light to transmit from the diameter-extended portion to the diameter-diminishing portion to emerge from its tip, and the stuffing member being disposed inside of the micro-pipe compared to prior techniques. The optical head of the invention is easier to be made, and it has a better focus for achieving optical exposure of sub-wave length focal spot and deep depth of focus.