Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.

Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.

Abstract: A two-sided scanning device includes a first image scanning module, a second image scanning module, a first scanning background component, a first brightness calibration component, a second scanning background component, and a second brightness calibration component. When the second image scanning module moves relative to the first image scanning module to a scanning position, the second image scanning module drives the first scanning background component to move relative to the first image scanning module, so that the first image scanning module and the second image scanning module are aligned with the first scanning background component and the second scanning background component, respectively. Therefore, the first scanning background component and the second scanning background component can be scanning backgrounds for the first image scanning module and the second image scanning module to generate a scanning image of an object with a size corresponding to an actual size of the object.

Abstract: A two-sided scanning device includes a first image scanning module, a second image scanning module, a first scanning background component, a first brightness calibration component, a second scanning background component, and a second brightness calibration component. When the second image scanning module moves relative to the first image scanning module to a scanning position, the second image scanning module drives the first scanning background component to move relative to the first image scanning module, so that the first image scanning module and the second image scanning module are aligned with the first scanning background component and the second scanning background component, respectively. Therefore, the first scanning background component and the second scanning background component can be scanning backgrounds for the first image scanning module and the second image scanning module to generate a scanning image of an object with a size corresponding to an actual size of the object.