Patents by Inventor Te-Kun Lin
Te-Kun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250341543Abstract: A method for detecting a contact force of a probe card is provided. The method includes supporting a substrate of the probe card using a support in contact with the substrate via a connector. The method includes detecting the contact force of the probe card while the substrate is supported by the support. The method also includes adjusting a position of a push base over the substrate based on the detected contact force, and adjusting the position of the push base over the substrate includes adjusting a plurality of first positioning elements in the support.Type: ApplicationFiled: July 14, 2025Publication date: November 6, 2025Inventors: Ming-Cheng HSU, Te-Kun LIN, Yu-Hsien TSAI, Wen-Tsai SU
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Patent number: 12429501Abstract: A method for detecting a contact force of a probe card is provided. The method includes contacting a pressure film sensor with a plurality of needles over a lower surface of the probe card. The method includes detecting the contact force of the probe card via the pressure film sensor. The method also includes adjusting a position of a push base over an upper surface of the probe card based on the detected contact force of the pressure film sensor.Type: GrantFiled: July 8, 2024Date of Patent: September 30, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ming-Cheng Hsu, Te-Kun Lin, Yu-Hsien Tsai, Wen-Tsai Su
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Publication number: 20250290952Abstract: The present disclosure is directed to a method of manufacturing one or more needles of a probe card by refining and processing a conductive body that extends from the probe card to form a respective tip at the end of the respective conductive body. Forming the respective tip of a respective needle includes removing respective portions from the end of the conductive body by flowing an electrolytic fluid between a conductive pattern structure and an end of the respective conductive body. Removing the respective portions with the flow of the electrons may be performed in multiple successive steps to form various needles with various sizes, shapes, and profiles (e.g., cylindrical, rectangular, triangular, trapezoidal, etc.).Type: ApplicationFiled: May 30, 2025Publication date: September 18, 2025Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ting-Yu CHIU, Yi-Neng CHANG, Wen-Chun TU, Te-Kun LIN, Chien Fang HUANG
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Publication number: 20250290953Abstract: The present disclosure is directed to a method of manufacturing one or more needles of a probe card by refining and processing a conductive body that extends from the probe card to form a respective tip at the end of the respective conductive body. Forming the respective tip of a respective needle includes removing respective portions from the end of the conductive body by flowing an electrolytic fluid between a conductive pattern structure and an end of the respective conductive body. Removing the respective portions with the flow of the electrons may be performed in multiple successive steps to form various needles with various sizes, shapes, and profiles (e.g., cylindrical, rectangular, triangular, trapezoidal, etc.).Type: ApplicationFiled: May 30, 2025Publication date: September 18, 2025Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ting-Yu CHIU, Yi-Neng CHANG, Wen-Chun TU, Te-Kun LIN, Chien Fang HUANG
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Patent number: 12326463Abstract: The present disclosure is directed to a method of manufacturing one or more needles of a probe card by refining and processing a conductive body that extends from the probe card to form a respective tip at the end of the respective conductive body. Forming the respective tip of a respective needle includes removing respective portions from the end of the conductive body by flowing an electrolytic fluid between a conductive pattern structure and an end of the respective conductive body. Removing the respective portions with the flow of the electrons may be performed in multiple successive steps to form various needles with various sizes, shapes, and profiles (e.g., cylindrical, rectangular, triangular, trapezoidal, etc.).Type: GrantFiled: February 7, 2023Date of Patent: June 10, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ting-Yu Chiu, Yi-Neng Chang, Wen-Chun Tu, Te-Kun Lin, Chien Fang Huang
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Publication number: 20240361354Abstract: A method for detecting a contact force of a probe card is provided. The method includes contacting a pressure film sensor with a plurality of needles over a lower surface of the probe card. The method includes detecting the contact force of the probe card via the pressure film sensor. The method also includes adjusting a position of a push base over an upper surface of the probe card based on the detected contact force of the pressure film sensor.Type: ApplicationFiled: July 8, 2024Publication date: October 31, 2024Inventors: Ming-Cheng HSU, Te-Kun LIN, Yu-Hsien TSAI, Wen-Tsai SU
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Patent number: 12055563Abstract: An apparatus is provided. The apparatus includes a stage and a plate disposed on the stage. The apparatus further includes a pressure film sensor that is formed on the plate and configured to detect a contact force between a plurality of needles on a probe head of a probe card and the pressure film sensor. The apparatus still includes a distance detector that is configured to detect a distance between the pressure film sensor and the needles. In addition, the apparatus includes an adjustment driver that is configured to adjust the probe card based on the detected contact force of the pressure film sensor.Type: GrantFiled: August 30, 2021Date of Patent: August 6, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ming-Cheng Hsu, Te-Kun Lin, Yu-Hsien Tsai, Wen-Tsai Su
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Publication number: 20240151743Abstract: The present disclosure is directed to a method of manufacturing one or more needles of a probe card by refining and processing a conductive body that extends from the probe card to form a respective tip at the end of the respective conductive body. Forming the respective tip of a respective needle includes removing respective portions from the end of the conductive body by flowing an electrolytic fluid between a conductive pattern structure and an end of the respective conductive body. Removing the respective portions with the flow of the electrons may be performed in multiple successive steps to form various needles with various sizes, shapes, and profiles (e.g., cylindrical, rectangular, triangular, trapezoidal, etc.).Type: ApplicationFiled: February 7, 2023Publication date: May 9, 2024Inventors: Ting-Yu CHIU, Yi-Neng CHANG, Wen-Chun TU, Te-Kun LIN, Chien Fang HUANG
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Publication number: 20230062076Abstract: An apparatus is provided. The apparatus includes a stage and a plate disposed on the stage. The apparatus further includes a pressure film sensor that is formed on the plate and configured to detect a contact force between a plurality of needles on a probe head of a probe card and the pressure film sensor. The apparatus still includes a distance detector that is configured to detect a distance between the pressure film sensor and the needles. In addition, the apparatus includes an adjustment driver that is configured to adjust the probe card based on the detected contact force of the pressure film sensor.Type: ApplicationFiled: August 30, 2021Publication date: March 2, 2023Inventors: Ming-Cheng HSU, Te-Kun LIN, Yu-Hsien TSAI, Wen-Tsai SU
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Patent number: 7182814Abstract: A sample holder for physical vapor deposition equipment, which is disposed in a vacuum chamber for holding samples, includes a transmission mechanism and a fastening mechanism. The transmission mechanism includes a stationary shaft and a transmission element. The fastening mechanism includes a rotation shaft unparalleled with the stationary shaft of the transmission mechanism, a support arm for securely holding the rotation shaft, and a rotational disk assembly that drives the rotation shaft and the support arm to rotate about the transmission mechanism. Two ends of the rotation shaft are connected to a rotation element and an affixation base. The rotation element rotates in response to the transmission element, thereby rendering the affixation base to perform inclined rotation. In this manner, the nano-meter ions can be coated continuously and homogeneously onto the sample surface to enhance the surface hardness, the erosion resistance and the life expectancy of the sample.Type: GrantFiled: August 12, 2005Date of Patent: February 27, 2007Inventor: Te-Kun Lin
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Publication number: 20070034148Abstract: A sample holder for physical vapor deposition equipment, which is disposed in a vacuum chamber for holding samples, includes a transmission mechanism and a fastening mechanism. The transmission mechanism includes a stationary shaft and a transmission element. The fastening mechanism includes a rotation shaft unparalleled with the stationary shaft of the transmission mechanism, a support arm for securely holding the rotation shaft, and a rotational disk assembly that drives the rotation shaft and the support arm to rotate about the transmission mechanism. Two ends of the rotation shaft are connected to a rotation element and an affixation base. The rotation element rotates in response to the transmission element, thereby rendering the affixation base to perform inclined rotation. In this manner, the nano-meter ions can be coated continuously and homogeneously onto the sample surface to enhance the surface hardness, the erosion resistance and the life expectancy of the sample.Type: ApplicationFiled: August 12, 2005Publication date: February 15, 2007Inventor: Te-Kun Lin