Patents by Inventor Te-Lung Cheng

Te-Lung Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982704
    Abstract: An electronic device includes a first substrate having a first bonding region, a first circuit, a second circuit, a third circuit, and a plurality of first conductive contacts. The first and second circuit are located at a first edge and a second edge of the first bonding region, the third circuit is located between the first and the second circuits. A second substrate having a second bonding region corresponding to the first bonding region in position and a fourth circuit, a fifth circuit, a sixth circuit, and a plurality of second conductive contacts. When the first substrate is bonded with the second substrate, the first circuit, the second circuit, the third circuit, the fourth circuit, the fifth circuit, and the sixth circuit form a loop, and the first and second conductive contacts are electrically connected to a plurality of signal circuits.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: May 14, 2024
    Assignee: E Ink Holdings Inc.
    Inventors: Ruei-Huan Rao, Te-Lung Cheng
  • Publication number: 20210318374
    Abstract: An electronic device includes a first substrate having a first bonding region, a first circuit, a second circuit, a third circuit, and a plurality of first conductive contacts. The first and second circuit are located at a first edge and a second edge of the first bonding region, the third circuit is located between the first and the second circuits. A second substrate having a second bonding region corresponding to the first bonding region in position and a fourth circuit, a fifth circuit, a sixth circuit, and a plurality of second conductive contacts. When the first substrate is bonded with the second substrate, the first circuit, the second circuit, the third circuit, the fourth circuit, the fifth circuit, and the sixth circuit form a loop, and the first and second conductive contacts are electrically connected to a plurality of signal circuits.
    Type: Application
    Filed: March 30, 2021
    Publication date: October 14, 2021
    Inventors: Ruei-Huan RAO, Te-Lung CHENG
  • Publication number: 20150378458
    Abstract: A touch sensing module includes a touch sensing circuit substrate, a glass substrate, a shielding layer, and an adhering member. The shielding layer is made of a photoresist material, and is provided on the glass substrate to shield a periphery thereof. The adhering member has a first adhering layer and a second adhering layer which are adhered to each other, wherein the first adhering layer is adhered on the glass substrate and the shielding layer, while the second adhering layer is adhered on the touch sensing circuit substrate. An area of the first adhering layer facing the glass substrate is smaller than that of the second adhering layer facing the touch sensing circuit substrate. Or, a hardness of the first adhering layer is less than that of the second adhering layer.
    Type: Application
    Filed: December 2, 2014
    Publication date: December 31, 2015
    Inventors: CHI-KUANG LAI, FENG-YU CHIANG, JYH-YU LIU, TE-LUNG CHENG
  • Publication number: 20150370394
    Abstract: A sensing structure of a one-glass solution (OGS) touch panel is provided, which has a designed diversion structure, such that an electrostatic discharge (ESD) protection capability of the sensing structure is improved. According to such design, the ESD protection capability of the sensing structure is improved without increasing a process complexity, so as to avoid energy release of electrostatic charges to cause a damage of the sensing structure.
    Type: Application
    Filed: June 9, 2015
    Publication date: December 24, 2015
    Inventors: Te-Lung Cheng, Ping-Chung Hsueh, Shih-Ming Tsao