Patents by Inventor Te-Pang Liu

Te-Pang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090296294
    Abstract: The present invention relates to an electro-static discharge (ESD) protection device with a low temperature co-fire ceramic (LTCC) and a manufacturing method thereof. The ESD protection device comprises a low temperature co-fire ceramic film having a first patterned conductive electrode material layer and a second patterned conductive electrode material layer therein. The low temperature co-fire ceramic film has at least one via exposing a portion of the first patterned conductive electrode material layer and a portion of the second patterned conductive electrode material layer simultaneously.
    Type: Application
    Filed: February 23, 2009
    Publication date: December 3, 2009
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventor: Te-Pang Liu
  • Publication number: 20090002910
    Abstract: The present invention relates to an over voltage protection device with an air gap and a manufacturing method thereof. The over voltage protection device provides over voltage protection by using an air gap extending into a first substrate and a second substrate. The air gap is formed by a first trench of the first substrate and a second trench of the second substrate.
    Type: Application
    Filed: April 3, 2008
    Publication date: January 1, 2009
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: TE-PANG LIU, SHENG-FU SU, YI-LIN WU
  • Publication number: 20090002911
    Abstract: The present invention relates to an over voltage protection device with an air gap and a manufacturing method thereof. The over voltage protection device provides over voltage protection by using an air gap extending into a first substrate and a second substrate. The air gap is formed by a first trench of the first substrate and a second trench of the second substrate.
    Type: Application
    Filed: April 3, 2008
    Publication date: January 1, 2009
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: TE-PANG LIU, SHENG-FU SU, YI-LIN WU
  • Publication number: 20090002906
    Abstract: The present invention relates to an over voltage protection device with an air gap and a manufacturing method thereof. The over voltage protection device provides over voltage protection by using an air gap extending into a first substrate and a second substrate. The air gap is formed by a first trench of the first substrate and a second trench of the second substrate.
    Type: Application
    Filed: April 3, 2008
    Publication date: January 1, 2009
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: TE-PANG LIU, SHENG-FU SU, YI-LIN WU
  • Publication number: 20080081226
    Abstract: The present invention relates to a material and structure of an over-voltage protection device. The material of the over-voltage protection device includes either a P-type semiconductor powder or an N-type semiconductor powder and an adhesive. The structure of the over-voltage protection device includes a first electrode, a second electrode, and a porous matrix connected between the first and second electrodes. The present invention further relates to a method of manufacturing the over-voltage protection device.
    Type: Application
    Filed: November 14, 2006
    Publication date: April 3, 2008
    Inventors: Te-Pang Liu, Hsiu-Yun Chang
  • Publication number: 20080079533
    Abstract: The present invention relates to a material of an over voltage protection device and an over voltage protection device manufactured by the material. The material comprises a non-conductive powder, a metal conductive powder, and an adhesive. The over voltage protection device comprises a first electrode, a second electrode, and a porous structure connected between the first electrode and the second electrode. The present invention also relates to a method for manufacturing the over voltage protection device. The present invention also relates to a method of adjusting the breakdown voltage of an over voltage protection device.
    Type: Application
    Filed: January 10, 2007
    Publication date: April 3, 2008
    Inventors: Te-Pang Liu, Hsiu-Yun Chang