Abstract: The present application discloses a sand removal device for a cooling tower and the sand removal device comprises a flushing assembly and a cyclone sand removal assembly. The flushing assembly comprises a first pipeline with a plurality of water outlets, and the first pipeline is used to spray liquid towards the bottom of the cooling tower through the plurality of water outlets. The cyclone sand removal assembly is used to extract the liquid at the bottom of the cooling tower, perform a sand removal treatment on the liquid and then discharge the sand-removed liquid into the bottom of the cooling tower. Through the present application, the sand removal effect on the liquid can be improved.

Abstract: The present application provides a fluid immersion cooling system, including a housing, a circuit board and a partition. There are a plurality of circuit boards, the plurality of circuit boards are spaced apart from each other in an accommodating cavity and are all located at a bottom of the housing, and a side of the circuit board close to the bottom of the housing is provided with a guide hole. There are a plurality of partitions, and one partition is located between two adjacent circuit boards and spaced apart from the corresponding circuit board. Areas between the partitions and the circuit boards, top areas of the partitions and the guide holes together form a continuously bent flow channel for the cooling liquid to flow.

Abstract: The present disclosure provides a circuit board assembly, relating to the field of electronic devices, the circuit board assembly includes: a circuit board; a chip, fixedly connected to the circuit board; a current-carrying component, fixedly connected to the circuit board; a heat dissipation component, fixedly connected to the chip and the current-carrying component. The heat dissipation component of this circuit board assembly has a larger connection area, which improves the connection reliability of the heat dissipation component.

Abstract: It relates to the technical field of cooling devices, a cooling integrated system configured to cool a computing device provided with a cooling channel, which includes a housing and a cooling apparatus integrally packaged inside the housing. The cooling apparatus includes a heat exchange mechanism, a liquid inlet pipe, a liquid return pipe, and a delivery pump. The heat exchange mechanism and the cooling channel are communicated by the liquid inlet pipe, and the heat exchange mechanism and the cooling channel are communicated by the liquid return pipe. The delivery pump is installed on the liquid inlet pipe and/or the liquid return pipe and configured to circulate coolant between the heat exchange mechanism and the cooling channel to cool the computing device. The cooling apparatuses in the cooling integrated system of the embodiments of the present application are integrally configured.

Abstract: The present application provides a fluid immersion cooling system, including a housing, a circuit board and a partition. There are a plurality of circuit boards, the plurality of circuit boards are spaced apart from each other in an accommodating cavity and are all located at a bottom of the housing, and a side of the circuit board close to the bottom of the housing is provided with a guide hole. There are a plurality of partitions, and one partition is located between two adjacent circuit boards and spaced apart from the corresponding circuit board. Areas between the partitions and the circuit boards, top areas of the partitions and the guide holes together form a continuously bent flow channel for the cooling liquid to flow.

Abstract: A heat consumption estimation method includes: obtaining the heart rate of a target user at a current moment; determining motion state feature information of the target user at the current moment, where the motion state feature information is configured to represent whether the target user is in a motion steady-state stage or a motion recovery stage at the current moment; and determining, according to the motion state feature information and the heart rate at the current moment, total heat consumption information of the target user in a motion process, where the motion process includes a process from a motion starting moment to the current moment.

Abstract: The present disclosure relates to a chassis, an electronic apparatus and a chassis exhaust method. The chassis includes: a housing, forming an accommodating cavity, where the accommodating cavity is configured for accommodating cooling liquid and a heating component immersed in the cooling liquid; a condenser, disposed in the accommodating cavity and configured for condensing the cooling liquid in a gas phase; a cooling liquid interface, disposed on the housing; and an exhaust component, located on the housing and at least configured for exhausting gas in the accommodating cavity when the cooling liquid is injected into the accommodating cavity through the cooling liquid interface.

Abstract: The present application discloses a computing apparatus and a heat dissipation apparatus, where the computing apparatus includes: a circuit board, a first surface of which is provided with at least one computing unit; a first heat dissipation assembly, arranged on a second surface of the circuit board, the second surface being opposite to the first surface; and at least one second heat dissipation assembly, correspondingly arranged on a package of the at least one computing unit, respectively. Through the present application, a heat dissipation efficiency of the computing apparatus can be improved.

Abstract: A cooling apparatus and an electronic device, where, the cooling apparatus includes: a condensing part and a sealing part, where the sealing part can accommodate a cooling liquid, and a circuit board mounted with a heat-producing element can be immersed in the cooling liquid; and the condensing part includes a condensing tube and an air cooling structure used for dissipating heat of the condensing tube, the condensing tube is connected with the sealing part, and the air cooling structure is provided on at least one side of the condensing tube.

Abstract: The present application discloses a sand removal device for a cooling tower and the sand removal device comprises a flushing assembly and a cyclone sand removal assembly. The flushing assembly comprises a first pipeline with a plurality of water outlets, and the first pipeline is used to spray liquid towards the bottom of the cooling tower through the plurality of water outlets. The cyclone sand removal assembly is used to extract the liquid at the bottom of the cooling tower, perform a sand removal treatment on the liquid and then discharge the sand-removed liquid into the bottom of the cooling tower. Through the present application, the sand removal effect on the liquid can be improved.

Abstract: The present disclosure relates to a chip module, a circuit board and an electronic device. The chip module includes: a chip; a heat-dissipating metal sheet, and a thermal conductive layer located between the chip and the heat-dissipating metal sheet, where a thermal conductive material included in the thermal conductive layer is a phase change material or a thermal conductive paste.