Patents by Inventor Te-Shao Hsu

Te-Shao Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210093801
    Abstract: A dermal injection guide including a needle housing unit comprising a guide tube including a semi-circular blade, a gripper, and a guide tube extension, which when combined with a syringe and cannula configures the dermal injection guide device. In its assembled state, the syringe and cannula is placed and secured in the needle housing unit. In operation, an incision point is made using the blade. Once the incision is made, the operator grips both the gripper and buttons located on the guide tube extension and applies force towards the distal end of the device. This, in turn, pushes the cannula through the needle housing unit and blade, and the cannula is inserted into the patient for the administration of dermal fillers into the dermal layer of the patient.
    Type: Application
    Filed: September 28, 2020
    Publication date: April 1, 2021
    Inventors: Tummuru Murali Krishna REDDY, Rajin AHUJA, Te-Shao HSU
  • Patent number: 7892723
    Abstract: A method for forming a patterned photoresist is provided, which is applicable to a substrate. The method includes: performing an implantation process over the substrate; next, performing a surface treatment process; then, forming a photoresist layer over the substrate; and thereafter, patterning the photoresist layer.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: February 22, 2011
    Assignee: United Microelectronics Corp.
    Inventor: Te-Shao Hsu
  • Publication number: 20090124095
    Abstract: A method for forming a patterned photoresist is provided, which is applicable to a substrate. The method includes: performing an implantation process over the substrate; next, performing a surface treatment process; then, forming a photoresist layer over the substrate; and thereafter, patterning the photoresist layer.
    Type: Application
    Filed: November 14, 2007
    Publication date: May 14, 2009
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventor: Te-Shao Hsu