Patents by Inventor Te-Tsung Chuo

Te-Tsung Chuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of wire-bonding circuit chip to bonding pad
    Patent number: 6457235
    Abstract: An integrated circuit device includes a substrate with a contact unit, an integrated circuit chip with a bonding pad unit, and a bonding wire interconnecting the bonding pad unit and the contact unit. The bonding wire has a electrical bonding contact attached to the bonding pad unit, a first extension portion extending from the electrical bonding contact in a direction that inclines slightly and upwardly relative to a plane of the substrate toward the contact unit, and a second extension portion extending from the first extension portion and attached to the contact unit.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: October 1, 2002
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Te-Tsung Chuo, Hui-Chin Fang