Abstract: A button module is provided. The button module comprises a base, a pressing part, and an elastic part. The pressing part includes a fixed end and a free end. The fixed end is pivotally connected to the base in a first axial direction. The elastic part is disposed on a side of the pressing part facing the base. The elastic part includes a first damping portion and a second damping portion selectively pressing against the base, where a hardness of the first damping portion is different from a hardness of the second damping portion.

Abstract: A foldable electronic device includes a first body, a second body, a pivot and a key module. The pivot is pivotally connected between the first body and the second body. The first body and the second body is configured to rotate relatively to each other through the pivot. The key module includes a bendable substrate and a sensor embedded in the bendable substrate. The bendable substrate is connected between the first body and the second body and covers an outer side of the pivot. The sensor generates a sensing signal in response to a press of a user upon the bendable substrate.

Abstract: A foldable electronic device includes a first body, a second body, a pivot, and a sensing component. The pivot is pivotally connected between the first body and the second body. The first body and the second body are configured to rotate relative to each other through the pivot, and the pivot includes a driving element. The sensing component is coupled to the pivot and the second body, and includes a sensing substrate and an interfering element connecting the sensing substrate. The driving element structurally interferes with the interfering element while rotating along with the pivot, so as to drive the interfering element to rotate, such that the sensing substrate rotates between an initial position where the sensing substrate leans on a back surface of the second body, and an operating position where an acute angle is formed between the sensing substrate and the back surface of the second body.

Abstract: A semiconductor device and method of fabricating the same include a substrate, a first epitaxial layer, a first protection layer, and a contact etching stop layer. The substrate includes a PMOS transistor region, and the first epitaxial layer is disposed on the substrate, within the PMOS transistor region. The first protection layer is disposed on the first epitaxial layer, covering surfaces of the first epitaxial layer. The contact etching stop layer is disposed on the first protection layer and the substrate, wherein a portion of the first protection layer is exposed from the contact etching stop layer.

Abstract: A button module is provided. The button module comprises a base, a pressing part, and an elastic part. The pressing part includes a fixed end and a free end. The fixed end is pivotally connected to the base in a first axial direction. The elastic part is disposed on a side of the pressing part facing the base. The elastic part includes a first damping portion and a second damping portion selectively pressing against the base, where a hardness of the first damping portion is different from a hardness of the second damping portion.

Abstract: An apparatus and a method for eliminating glare are disclosed, wherein this method includes steps as follow. First, a first image is captured from an object when a first light source radiates light and a second light source is turned off, and a second image is captured from the object when the first light source is turned off and the second light source radiates light, wherein the first and second light sources are separate from each other. Then, a first glaring area is removed from the first image to create a first modified image, and a second glaring area is removed from the second image to create a second modified image. Then, the first and second modified images are merged to create a merged image.