Patents by Inventor Te-Wei Li

Te-Wei Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240103575
    Abstract: A foldable electronic device includes a first body, a second body, a pivot and a key module. The pivot is pivotally connected between the first body and the second body. The first body and the second body is configured to rotate relatively to each other through the pivot. The key module includes a bendable substrate and a sensor embedded in the bendable substrate. The bendable substrate is connected between the first body and the second body and covers an outer side of the pivot. The sensor generates a sensing signal in response to a press of a user upon the bendable substrate.
    Type: Application
    Filed: November 21, 2022
    Publication date: March 28, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Te-Wei Huang, Pei-Chiang Lin, Sih-Ci Li
  • Publication number: 20240103570
    Abstract: A foldable electronic device includes a first body, a second body, a pivot, and a sensing component. The pivot is pivotally connected between the first body and the second body. The first body and the second body are configured to rotate relative to each other through the pivot, and the pivot includes a driving element. The sensing component is coupled to the pivot and the second body, and includes a sensing substrate and an interfering element connecting the sensing substrate. The driving element structurally interferes with the interfering element while rotating along with the pivot, so as to drive the interfering element to rotate, such that the sensing substrate rotates between an initial position where the sensing substrate leans on a back surface of the second body, and an operating position where an acute angle is formed between the sensing substrate and the back surface of the second body.
    Type: Application
    Filed: November 15, 2022
    Publication date: March 28, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Te-Wei Huang, Sih-Ci Li
  • Patent number: 10825621
    Abstract: A keyboard key structure includes a plurality of keycaps. Each keycap has a keycap body and an outward layer. The keycap body has an appearance with a first color. The outward layer has an appearance with a second color different from the first color. The outward layer is formed above the keycap body. The outward layer is formed with an engraving portion. The first color is exposed in the engraving portion. The present invention also provides a method of manufacturing a keycap of a keyboard key.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: November 3, 2020
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Che-Hui Tsai, Te-Wei Li, Chieh-Liang Hsiao, Jen-Chieh Huang
  • Publication number: 20170076881
    Abstract: A keyboard key structure includes a plurality of keycaps. Each keycap has a keycap body and an outward layer. The keycap body has an appearance with a first color. The outward layer has an appearance with a second color different from the first color. The outward layer is formed above the keycap body. The outward layer is formed with an engraving portion. The first color is exposed in the engraving portion. The present invention also provides a method of manufacturing a keycap of a keyboard key.
    Type: Application
    Filed: February 25, 2016
    Publication date: March 16, 2017
    Inventors: CHE-HUI TSAI, TE-WEI LI, CHIEH-LIANG HSIAO, JEN-CHIEH HUANG
  • Patent number: 7742312
    Abstract: An electronic device and method of fabrication are provided. The electronic device comprises a substrate, a patterned conductive layer serving as an antenna layer formed on the outer surface of the substrate, electrically connected with a printed circuit board (PCB) for sending or receiving a wireless signal, wherein the substrate is placed between the patterned conductive layer and PCB. The patterned conductive layer may be electrically connected to the PCB through a hole in the substrate by a connecting piece. The substrate may be a housing of the electronic device.
    Type: Grant
    Filed: July 3, 2007
    Date of Patent: June 22, 2010
    Assignee: Lite-On Technology Corporation
    Inventor: Te-Wei Li
  • Publication number: 20080008890
    Abstract: An electronic device and method of fabrication are provided. The electronic device comprises a substrate, a patterned conductive layer serving as an antenna layer formed on the outer surface of the substrate, electrically connected with a printed circuit board (PCB) for sending or receiving a wireless signal, wherein the substrate is placed between the patterned conductive layer and PCB. The patterned conductive layer may be electrically connected to the PCB through a hole in the substrate by a connecting piece. The substrate may be a housing of the electronic device.
    Type: Application
    Filed: July 3, 2007
    Publication date: January 10, 2008
    Applicant: LITE-ON TECHNOLOGY CORPORATION
    Inventor: Te Wei Li