Patents by Inventor Te-Wei TSENG

Te-Wei TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240069410
    Abstract: A variable aperture module includes a blade assembly including movable blades, a positioning element including positioning structures and a driving part including a rotation element. The movable blades are disposed around an optical axis to form a light passable hole with adjustable size for different hole size states and each have an inner surface to define the contour of the light passable hole in each hole size state. The positioning structures correspond to the movable blades. The rotation element is rotatable with respect to the positioning element and is configured to rotate the movable blades to adjust a size of the light passable hole. There are matte structures disposed on each inner surface. Each matte structure is single structure extending towards the optical axis, such that at least part of the contour of the light passable hole has an undulating shape at least in several hole size states.
    Type: Application
    Filed: April 13, 2023
    Publication date: February 29, 2024
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Te-Sheng TSENG, Chen Wei FAN, Ming-Ta CHOU, Kuan-Ming CHEN
  • Patent number: 10588184
    Abstract: A light-emitting device including a substrate, plural light-emitting units, and a sealing member is disclosed. The substrate includes plural electrode pads. The light-emitting units are disposed on the substrate and each include an LED chip. The LED chips are electrically connected with the electrode pads. The sealing member is disposed on the substrate, covers a side surface of each of the light-emitting units, and includes a surrounding portion surrounding the light-emitting units and a separating portion disposed between the light-emitting units. An LED package structure including the aforementioned substrate, light-emitting units, and sealing member is also disclosed. The light-emitting units can generate light of different colors or color temperatures and allow adjustment of the colors or color temperatures.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: March 10, 2020
    Assignee: EVERLIGHT ELECTRONICS CO., LTD.
    Inventors: Te-Wei Tseng, Pyng Yu
  • Publication number: 20180103513
    Abstract: A light-emitting device including a substrate, plural light-emitting units, and a sealing member is disclosed. The substrate includes plural electrode pads. The light-emitting units are disposed on the substrate and each include an LED chip. The LED chips are electrically connected with the electrode pads. The sealing member is disposed on the substrate, covers a side surface of each of the light-emitting units, and includes a surrounding portion surrounding the light-emitting units and a separating portion disposed between the light-emitting units. An LED package structure including the aforementioned substrate, light-emitting units, and sealing member is also disclosed. The light-emitting units can generate light of different colors or color temperatures and allow adjustment of the colors or color temperatures.
    Type: Application
    Filed: October 11, 2017
    Publication date: April 12, 2018
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventors: Te-Wei TSENG, Pyng YU