Patents by Inventor Te-Wen LEE

Te-Wen LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lamination forming system
    Patent number: 11331840
    Abstract: A lamination forming system includes a melt extruder, a nozzle head and a carrier unit. The melt extruder is configured to melt a plastic raw material into a plastic melt and to deliver the same. The nozzle head includes a sprue channel that has an inlet connected to the melt extruder for entry of the melt plastic into the sprue channel, and an outlet disposed distally from the inlet to deliver the plastic melt from the sprue channel. The carrier unit includes a slide table controllable to move relative to the nozzle head. The slide table is configure to carry the plastic melt outputted from the nozzle head.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: May 17, 2022
    Assignees: FORMOSA PLASTICS CORPORATION, NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Chung-Ching Huang, Te-Wen Lee, Jen-Long Wu, Wen-Hao Kang, Ying-Cheng Weng
  • LAMINATION FORMING SYSTEM
    Publication number: 20200338798
    Abstract: A lamination forming system includes a melt extruder, a nozzle head and a carrier unit. The melt extruder is configured to melt a plastic raw material into a plastic melt and to deliver the same. The nozzle head includes a sprue channel that has an inlet connected to the melt extruder for entry of the melt plastic into the sprue channel, and an outlet disposed distally from the inlet to deliver the plastic melt from the sprue channel. The carrier unit includes a slide table controllable to move relative to the nozzle head. The slide table is configure to carry the plastic melt outputted from the nozzle head.
    Type: Application
    Filed: April 26, 2019
    Publication date: October 29, 2020
    Inventors: Chung-Ching HUANG, Te-Wen LEE, Jen-Long WU, Wen-Hao KANG, Ying-Cheng WENG