Abstract: An endoscopic image capturing assembly is provided and includes a holder, an image sensing device, a conducting track, a cable and a lens set. The holder includes a first surface and a second surface perpendicular to the first surface. The image sensing device is mounted on the first surface and includes an electrical connecting component. The conducting track is formed from the first surface to the second surface of the holder and electrically connected to the electrical connecting component. The cable is mounted on the second surface. A terminal of the cable is electrically connected to the electrical connecting component of the image sensing device by the conducting track. The lens set is assembled with the image sensing device. An optical axis of the lens set is parallel to an extending direction of the cable. Furthermore, a related endoscopic device is provided.

Abstract: An image capturing assembly is provided and includes a fixture, a lens assembly, an image sensing device and a circuit board. The fixture includes a fixture body and at least one first contact. An accommodating space is formed on the fixture body. The at least one first contact is disposed on the fixture body. The lens assembly is engaged with the fixture body. The image sensing device is disposed inside the accommodating space. The image sensing device includes at least one second contact electrically connected to the at least one first contact. The circuit board includes a board body and at least one third contact. The board body is perpendicular to and affixed with the fixture body. The at least one third contact is disposed on the board body and electrically connected to the at least one first contact. Besides, a related endoscope is further provided.

Abstract: An endoscopic image capturing assembly is provided and includes a holder, an image sensing device, a light emitting component and a conducting track. The holder includes a first surface, a protruding end surface, a first body and a protruding body connected to the first body and protruding from the first surface. The first surface is formed on the first body. The protruding end surface is formed on an end portion of the protruding body away from the first surface. The image sensing device is mounted on the first surface. The light emitting component is mounted on the protruding end surface. The conducting track is at least partially embedded in the holder and electrically connected to one of the image sensing device and the light emitting component. Besides, an endoscopic device having the aforementioned endoscopic image capturing assembly is also provided.

Abstract: An endoscopic image capturing assembly is provided and includes a holder, an image sensing device, a conducting track, a cable and a lens set. The holder includes a first surface and a second surface perpendicular to the first surface. The image sensing device is mounted on the first surface and includes an electrical connecting component. The conducting track is formed from the first surface to the second surface of the holder and electrically connected to the electrical connecting component. The cable is mounted on the second surface. A terminal of the cable is electrically connected to the electrical connecting component of the image sensing device by the conducting track. The lens set is assembled with the image sensing device. An optical axis of the lens set is parallel to an extending direction of the cable. Furthermore, a related endoscopic device is provided.

Abstract: An image capturing assembly is provided and includes a fixture, a lens assembly, an image sensing device and a circuit board. The fixture includes a fixture body and at least one first contact. An accommodating space is formed on the fixture body. The at least one first contact is disposed on the fixture body. The lens assembly is engaged with the fixture body. The image sensing device is disposed inside the accommodating space. The image sensing device includes at least one second contact electrically connected to the at least one first contact. The circuit board includes a board body and at least one third contact. The board body is perpendicular to and affixed with the fixture body. The at least one third contact is disposed on the board body and electrically connected to the at least one first contact. Besides, a related endoscope is further provided.

Abstract: A wire soldered structure includes a substrate including a main body, a first conducting layer disposed on the main body, and a through hole extending through the main body and the first conducting layer; a wire including a soldered portion that is disposed on the first conducting layer and that is adjacent to the through hole; and a solder disposed in the through hole; wherein the soldered portion of the wire is soldered to the first conducting layer of the substrate via the solder.

Abstract: An endoscope device, a flexible printed circuit board assembly and a flexible printed circuit board thereof are provided. The flexible printed circuit board includes a sensing module carrier portion, a first body portion, a second body portion, a third body portion, a fourth body portion and a light-emitting element carrier portion. The first body portion and the second body portion are respectively located on opposite sides of the sensing module carrying portion. The fourth body portion is connected with the second body portion, and the third body portion and the fourth body portion are respectively located on opposite sides of the sensing module carrying portion. The light-emitting element carrier portion includes a first carrier side portion connected to the third body portion and a second carrier side portion connected to the third body portion. The first and the second carrier side portions are separated from each other.

Abstract: A wire soldered structure includes a substrate including a main body, a first conducting layer disposed on the main body, and a through hole extending through the main body and the first conducting layer; a wire including a soldered portion that is disposed on the first conducting layer and that is adjacent to the through hole; and a solder disposed in the through hole; wherein the soldered portion of the wire is soldered to the first conducting layer of the substrate via the solder.

Abstract: Specific nucleic acid sequences, e.g., SEQ ID NOs: 1–8, for detecting Escherichia coli. Also disclosed is a method of detecting Escherichia coli. The method includes providing a sample having a nucleic acid from an unknown microorganism; amplifying the nucleic acid with an upstream primer containing SEQ ID NO: 1 or 3 and a downstream primer containing SEQ ID NO: 2 or 4, each primer being 18–40 nucleotides in length; and detecting an amplification product. Detection of the amplification product, e.g., using SEQ ID NO: 5, 6, 7, or 8 as a probe, indicates the presence of Escherichia Coli.

Abstract: Specific nucleic acid sequences, e.g., SEQ ID NOs: 1-8, for detecting Escherichia coli. Also disclosed is a method of detecting Escherichia coli. The method includes providing a sample having a nucleic acid from an unknown microorganism; amplifying the nucleic acid with an upstream primer containing SEQ ID NO: 1 or 3 and a downstream primer containing SEQ ID NO: 2 or 4, each primer being 18-40 nucleotides in length; and detecting an amplification product. Detection of the amplification product, e.g., using SEQ ID NO: 5, 6, 7, or 8 as a probe, indicates the presence of Escherichia Coli.