Abstract: An electronic device is provided. The electronic device includes multiple transducer pixels. Each of the transducer pixels includes a sonic transducer, a demultiplexer electrically connected to the sonic transducer, a driving line electrically connected to the sonic transducer, a switching line electrically connected to the demultiplexer, and a reading line electrically connected to the demultiplexer. The driving line is used to provide a driving signal to the sonic transducer to emit sonic waves. The switching line is used to turn on the demultiplexer to output the sensing signal received by the sonic transducer to the reading line.

Abstract: A heating device is provided. The heating device includes a substrate, a thin-film transistor disposed on the substrate, a heater disposed on the substrate, and a bridging component. The thin-film transistor includes a gate, a semiconductor layer, a source, and a drain. The bridging component is electrically connected to the heater and either the source or the drain. A method for fabricating the heating device is also provided.

Abstract: An electronic device including a substrate, a thin film transistor, a micro pump, and a micro fluid platform is provided. The thin film transistor is disposed on the substrate. The micro pump is disposed on the substrate and electrically connected to the thin film transistor. The micro fluid platform is disposed on the substrate and coupled to the micro pump. The micro pump is configured to travel a to-be-test sample to the micro fluid platform.

Abstract: The electronic device includes a substrate; an active layer disposed above the first substrate; a first signal line disposed above the substrate and overlapped with the active layer; and a conductive pattern disposed above the substrate. The conductive pattern includes a first side extending in a first direction, a second side extending in the first direction, and a third side connected between the first side and the second side, and wherein the third side includes a part that the part is not parallel to the first direction and not perpendicular to the first direction, and the part is located out of the first signal line and overlapped with the active layer.

Abstract: The present disclosure provides a sensing device including a substrate and a sensing pixel. The sensing pixel is disposed on the substrate and includes an electrode and a thermistor. The thermistor is electrically connected to the electrode and is separated from the substrate by an air gap. When the sensing pixel is operated in a period, the electrode receives a voltage, and a part of the thermistor moves toward the substrate, such that the thermistor is in thermal conduction with the substrate.

Abstract: An electronic device includes a first substrate, a semiconductor element, a first inorganic layer, a first electrode, a second electrode and a conductive element. The first inorganic layer is disposed between the first substrate and the semiconductor element. The first inorganic layer has a first surface adjacent to the semiconductor element, a second surface opposite to the first surface, and a through-hole penetrating from the first surface to the second surface. The first electrode is disposed between the first substrate and the first inorganic layer. The second electrode has a first portion disposed on the second surface of the first inorganic layer, and a second portion disposed in the through-hole of the first inorganic layer. The conductive element is disposed between the first electrode and the second electrode. Moreover, in a cross-sectional view of the electronic device, the first portion of the second electrode has a rounded corner.

Abstract: An electronic device having a sensing region and a non-sensing region includes a sensing element, a first light shielding layer and a second light shielding layer. The sensing element is disposed corresponding to the sensing region. The first light shielding layer includes at least one first opening corresponding to the sensing element. The second light shielding layer includes at least one second opening overlapped with the first opening. In a cross-section view, a boundary between the sensing region and the non-sensing region is at an outer side of an edge of a portion of the first light shielding layer, and a horizontal distance between an edge of a portion of the second light shielding layer and the sensing element is greater than or equal to a vertical distance between the portion of the second light shielding layer and the sensing element in a top-view direction of the electronic device.

Abstract: A method of manufacturing a sensing device includes: providing a substrate; forming a circuit element on the substrate; forming a sensing element on the substrate; forming a planarization layer on the sensing element and the circuit element; forming a first opening in the planarization layer, wherein the first opening overlaps with the circuit element; and forming a second opening in the planarization layer, wherein the second opening overlaps with the sensing element. In addition, the first opening and the second opening are formed by different processes.

Abstract: A sensing device is provided. The sensing device includes a driving substrate, a sensing module, and a plurality of bonding pads. The driving substrate includes a first substrate and a plurality of driving circuits disposed on the first substrate. Each of the driving circuits includes a plurality of thin-film transistors. The sensing module is bonded to the driving substrate, and the sensing module includes a second substrate and a plurality of sensing elements disposed on the second substrate. The sensing module is bonded to the driving substrate through the bonding pads. In addition, each of the driving circuits is electrically connected to at least one of the sensing elements. The wavelength of light penetrating the first substrate is greater than or equal to 4 ?m and less than or equal to 10 ?m. An electronic device including the sensing device is also provided.

Abstract: An electronic device is provided. The electronic device includes a substrate, a first light-shielding layer, a second light-shielding layer, a third light-shielding layer and an optical sensing element. The first light-shielding layer is disposed on the substrate and has a first opening. The second light-shielding layer is disposed on the first light-shielding layer and has a second opening. The third light-shielding layer is disposed on the second light-shielding layer and has a third opening. The optical sensing element is disposed on the substrate, and overlapped with the first opening. In addition, in a top-view diagram, centers of the first opening, the second opening and the third opening are separated from each other along a first direction, and the first direction is a line connecting a center of the first opening and a center of the third opening.

Abstract: A sensing device is provided. The sensing device includes a sensing circuit, a plurality of sensing elements, and a plurality of light-collecting elements. The light-collecting elements are for collecting lights to the plurality of sensing elements. The plurality of sensing elements are configured to generate a plurality of sensing signals according to the lights that are collected, and output the plurality of sensing signals as a whole to the sensing circuit.

Abstract: A sensing device is provided herein, which operates in a reset period, an exposure period, and a readout period. The sensing device includes a first transistor, a second transistor, a detection device, and a third transistor. The first transistor includes a control terminal and a first terminal. The second transistor is coupled to the first transistor and configured to set the voltage of the control terminal during the exposure period. The sensing device is coupled to the first transistor and configured to change the voltage of the control terminal during the exposure period. The third transistor is coupled to the first transistor and includes an output terminal outputting a sense signal from the first terminal during the readout period. The first transistor is an N-type transistor and the third transistor is a P-type transistor.

Abstract: A card device including a first substrate, a circuit board, a sensing unit and a protective layer is disclosed. The circuit board is disposed on the first substrate, and the circuit board includes an accommodating recess. The sensing unit is disposed in the accommodating recess and electrically connected to the circuit board. The protective layer is disposed on the circuit board, and the protective layer covers the circuit board and the sensing unit.

Abstract: An electronic device is provided. The electronic device includes an optical sensing module that includes an optical sensor array. The optical sensor array includes at least one optical sensor, at least one transparent layer disposed on the optical sensor array, and a microlens array. The microlens array includes at least one microlens and is disposed on the transparent layer.

Abstract: A method of manufacturing an electronic device includes: forming a sacrificial layer on a substrate; forming a semiconductor structure on the sacrificial layer; separating the semiconductor structure from the substrate; detecting defects on the substrate; and classifying the substrate.

Abstract: An optical sensing device including a substrate, a light-sensing element, a light-shielding layer, an insulating layer and a light-collecting element is disclosed. The light-sensing element is disposed on the substrate. The light-shielding layer is disposed on the light-sensing element and includes a first opening overlapping the light-sensing element. The insulating layer is disposed on the light-shielding layer and includes a second opening overlapping the first opening. The light-collecting element is disposed on the insulating layer and overlaps the second opening and includes a focus distance F and a first refractive index N1. A second refractive index N3 of an external medium, the first refractive index N1, the focus distance F, and a radius R? of curvature of the light-collecting element meet the following equation: N1/N3=F/(F?R?).

Abstract: A card device and a manufacturing method thereof are disclosed. The card device includes a first substrate, a circuit board, a sensing module and a second substrate. The circuit board is disposed on the first substrate, and the circuit board includes an accommodating recess. The sensing module is disposed in the accommodating recess. The sensing module includes a sensing unit and a protective layer formed on the sensing unit, and the sensing unit is electrically connected to the circuit board. The second substrate is disposed on the circuit board. The second substrate includes an opening, and the opening exposes the protective layer.

Abstract: An operation method of a heater device with a memory unit, wherein the heater device includes a plurality of heater circuits, each of the plurality of heater circuits includes a first transistor and a second transistor. In a burning mode, selectively turning on at least one of the first transistors according to a first signal, so that a first current generated by voltage signals coupled to two terminals of the first transistor passes through the memory unit. In a reading mode, sequentially turning on the first transistors to determine states of the memory units. In a heating mode, selectively turning on at least one of the second transistors according to a second signal, so that a second current generated by voltage signals coupled to two terminals of the second transistor passes through a heater.

Abstract: An electronic device includes a scan line disposed on a first substrate and extending along a first direction; a conductive element disposed on the first substrate and a portion of the conductive element extending along a second direction different from the first direction; and an active layer disposed between the conductive element and the first substrate. In a top view, the active layer includes a first connecting region electrically connected to the conductive element through a first via hole; a first overlapping region overlapping a portion of the scan line; first region disposed between the first connecting region and the first overlapping region, wherein the first region extends along the second direction and overlaps the portion of the conductive element; and a turning region between the first overlapping region and the first region.

Abstract: A heat source detection system includes an infrared light detector, a visible light detector, and a processing unit. The processing unit performs an operation according to at least one instruction, wherein the operation includes steps of: acquiring an infrared light image from the infrared light detector; identifying at least a heat source target according to at least one heat source edge in the infrared light image; determining whether at least one preset condition occurs in the at least one heat source target; and activating the visible light detector when the at least preset condition occurs in the at least one heat source target.