Abstract: An image processing method includes following operations: acquiring, by a spectrum analyzer, spectrum information of a display device; calculating, by a processor, a first low blue light parameter according to the spectrum information; transmitting, by the processor, the first low blue light parameter to the display device; calculating, by the display device, first blue light hazard intensity of a first region of input image data; and when the first blue light hazard intensity is greater than a first threshold value, applying, by the display device, the first low blue light parameter to the first region so as to output a final image.

Abstract: A facebow-free transfer method includes: registering virtual upper and lower casts respectively to an upper teeth part of a virtual maxilla model and a lower teeth part of a virtual mandible model so as to form a virtual teeth and jaw model; mounting the virtual teeth and jaw model on a virtual articulator; generating a virtual occlusion transfer module that is mounted on the virtual articulator and that has a part extending to and fitting in an in-between space of virtual upper and lower casts of the virtual teeth and jaw model; and creating an actual occlusion transfer device that is to be mounted on an articulator based on the virtual occlusion transfer module.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids individually having a coefficient of thermal expansion (CTE) after imidization of more than 20 ppm and less than 20 ppm on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, to produce a polyimide composite flexible board, which is used as a printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability, and no warp without using an adhering agent.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises mixing a polyamic acid resin having a CTE value after imidization of more than 20 ppm and a polyamic acid resin having a CTE value after imidization of less than 20 ppm in a certain ratio, and coating the mixture on a metal foil, then subjecting the polyamic acids to imidization, to obtain the polyimide composite flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability, and no warp without using an adhering agent.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids individually having a glass transition temperature of from 280 to 330° C. and from 190 to 280° C. after imidization on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, and then pressing the polyimide-containing metal foil with each other or with another metal foil under high temperature to produce a two-metal-side printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability without using an adhering agent.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids each having a glass transition temperature of from 280 to 300° C., from 300 to 350° C., and from 190 to 280° C. after imidization on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, and then pressing the polyimide-containing metal foil with a metal foil under high temperature to produce a two-metal-side printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability without using an adhering agent.