Patents by Inventor TE-YUAN PENG

TE-YUAN PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11943913
    Abstract: A semiconductor structure includes a substrate and a buried gate structure in the substrate. The buried gate structure includes a gate dielectric layer formed on the sidewall and the bottom surface of a trench in the substrate, a barrier layer formed in the trench and on the sidewall and the bottom surface of the gate dielectric layer, a first work function layer formed in the trench and including a main portion and a protruding portion, a second work function layer formed at opposite sides of the protruding portion, and an insulating layer formed in the trench and on the protruding portion of the first work function layer and the second work function layer. The barrier layer surrounds the main portion of the first work function layer. The area of the top surface of the protruding portion is less than the area of the bottom surface of the protruding portion.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: March 26, 2024
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Te-Hsuan Peng, Kai Jen, Mei-Yuan Chou
  • Patent number: 11412318
    Abstract: The application discloses a virtual reality (VR) head-mounted display (HMD) device, and the VR HMD is worn on a head of a user, and includes a body and a fixing assembly. The fixing assembly includes a support arm set, two pivot pieces and two audio elements. The support arm set has a first end portion and a second end portion respectively located on two opposite sides of the body. The two pivot pieces are respectively connected to the first end portion and the second end portion, and are respectively pivotally connected to the two opposite sides of the body. The two audio elements are respectively disposed between the first end portion and one of the two pivot pieces and between the second end portion and another of the two pivot pieces. Each of the two audio elements has a sound guide hole facing an ear of the user.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: August 9, 2022
    Assignee: PEGATRON CORPORATION
    Inventors: Te-Yuan Peng, Chieh-Chun Kang
  • Publication number: 20210337288
    Abstract: The application discloses a virtual reality (VR) head-mounted display (HMD) device, and the VR HMD is worn on a head of a user, and includes a body and a fixing assembly. The fixing assembly includes a support arm set, two pivot pieces and two audio elements. The support arm set has a first end portion and a second end portion respectively located on two opposite sides of the body. The two pivot pieces are respectively connected to the first end portion and the second end portion, and are respectively pivotally connected to the two opposite sides of the body. The two audio elements are respectively disposed between the first end portion and one of the two pivot pieces and between the second end portion and another of the two pivot pieces. Each of the two audio elements has a sound guide hole facing an ear of the user.
    Type: Application
    Filed: March 17, 2021
    Publication date: October 28, 2021
    Inventors: TE-YUAN PENG, CHIEH-CHUN KANG