Abstract: The present invention discloses an apparatus and a method for breaking up air bubbles in a liquid flow which is conveyed in a fluid conduit by providing sharp protuberances on the inside wall of the conduit. The sharp protuberances break up large air bubbles into small air bubbles or micro-bubbles such that they can be easier disposed of after passing through a liquid dispensing nozzle. Various designs on the inner wall of the present invention fluid conduit can be provided as long as sharp protuberances exist for dividing the bubbles.

Abstract: A hand operated tool for picking up a semiconductor wafer includes a vacuum cylinder with a piston. The user first pushes the piston to its forward most position against the force of a spring and a catch mechanism locks the piston in this position. Later, the user presses a button to release the catch mechanism and allow the piston to move to its rear most position in response to the force of the spring. The motion of the piston creates a suitable vacuum in the front part of the cylinder. A vacuum head is attached to the forward end of the cylinder. It has a generally square flat surface with sides about one third the diameter of a wafer. The user positions this surface in contact with a wafer and then pushes the button to releases the piston and apply a vacuum to grasp the wafer. The user moves the wafer to its destination and then presses a second button to allow air to enter the vacuum side of the cylinder and thereby release the grasp on the wafer.