Patents by Inventor Tean Wee One

Tean Wee One has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip assembly process for ultra thin substrate and package on package assembly
    Patent number: 8847368
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: September 30, 2014
    Assignee: Intel Corporation
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee One
  • FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
    Publication number: 20120319276
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: August 31, 2012
    Publication date: December 20, 2012
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee One