Patents by Inventor Tean Wee Ong

Tean Wee Ong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip assembly process for ultra thin substrate and package on package assembly
    Patent number: 9397016
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: July 19, 2016
    Assignee: Intel Corporation
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee Ong
  • PICKHEAD FOR SOLDER BALL PLACEMENT ON AN INTEGRATED CIRCUIT PACKAGE
    Publication number: 20160181222
    Abstract: Embodiments of the present disclosure are directed toward a pickhead for solder ball placement on an integrated circuit (IC) package, and associated systems and techniques. The pickhead may include a body having a bottom surface that defines a bottom plane of the pickhead. The pickhead may further include a plurality of cavities in the bottom surface to hold respective solder balls to be placed on the IC package. Individual cavities of the plurality of cavities may be recessed from the bottom surface by different recess amounts to provide different extensions of the solder balls with respect to the bottom plane. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: December 23, 2014
    Publication date: June 23, 2016
    Inventors: Mohit Sood, Wei Tan, George F. Robinson, Hin Huat Teoh, Tean Wee Ong, Ha Ong Wong, Boon Yee Ee, Kok Beng Hong
  • FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
    Publication number: 20150076692
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: September 29, 2014
    Publication date: March 19, 2015
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee Ong
  • Flip chip assembly process for ultra thin substrate and package on package assembly
    Patent number: 8258019
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: September 4, 2012
    Assignee: Intel Corporation
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee Ong
  • FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
    Publication number: 20090321928
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 30, 2008
    Publication date: December 31, 2009
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee Ong