Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. The circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. The circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. A location of the metal floor plate corresponds to a location of the cavity. The metal floor plate is electrically floating and isolated by the dielectric material. The semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. The filling material is disposed between the semiconductor die and the circuit substrate. The filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. The circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. The circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. A location of the metal floor plate corresponds to a location of the cavity. The metal floor plate is electrically floating and isolated by the dielectric material. The semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. The filling material is disposed between the semiconductor die and the circuit substrate. The filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. The circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. The circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. A location of the metal floor plate corresponds to a location of the cavity. The metal floor plate is electrically floating and isolated by the dielectric material. The semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. The filling material is disposed between the semiconductor die and the circuit substrate. The filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.

Abstract: A thin film solar cell module of see-through type having cells connected in series and disposed on an opaque substrate with holes is provided. The thin film solar cell module includes a first electrode, a second electrode, and a photoelectric conversion layer disposed between the first electrode and the second electrode. The first electrode is disposed on the opaque substrate and is composed of a first comb electrode and block-like first electrodes. The second electrode is disposed above the first electrode and is composed of a second comb electrode and block-like second electrodes. A portion of the block-like first electrodes, a portion of the opaque substrate, and the holes are exposed between the second comb electrode and the block-like second electrodes. The second comb electrode and the first comb electrode are disposed symmetrically, and the block-like first electrodes and the block-like second electrodes are disposed by parallel displacement.

Abstract: The prevent disclosure discloses a structure of thermal resistive layer and the method of forming the same. The thermal resistive structures, formed on a plastic substrate, comprises a porous layer, formed on said plastic substrate, including a plurality of oxides of hollow structure, and a buffer layer, formed on said porous layer, wherein said porous layer can protect said plastic substrate from damage caused by the heat generated during manufacturing process. With the structure and method disclosed above, making a thin film transistor and forming electronic devices on the plastic substrate in the technology of Low Temperature PolySilicon, i.e. LTPS, without changing any parameters is possible.

Abstract: A thin film solar cell module of see-through type having cells connected in series and disposed on an opaque substrate with holes is provided. The thin film solar cell module includes a first electrode, a second electrode, and a photoelectric conversion layer disposed between the first electrode and the second electrode. The first electrode is disposed on the opaque substrate and is composed of a first comb electrode and block-like first electrodes. The second electrode is disposed above the first electrode and is composed of a second comb electrode and block-like second electrodes. A portion of the block-like first electrodes, a portion of the opaque substrate, and the holes are exposed between the second comb electrode and the block-like second electrodes. The second comb electrode and the first comb electrode are disposed symmetrically, and the block-like first electrodes and the block-like second electrodes are disposed by parallel displacement.

Abstract: The prevent invention discloses a structure of thermal resistive layer and the method of forming the same. The thermal resistive structures, formed on a plastic substrate, comprises a porous layer, formed on said plastic substrate, including a plurality of oxides of hollow structure, and a buffer layer, formed on said porous layer, wherein said porous layer can protect said plastic substrate from damage caused by the heat generated during manufacturing process. With the structure and method disclosed above, making a thin film transistor and forming electronic devices on the plastic substrate in the technology of Low Temperature PolySilicon, i.e. LTPS, without changing any parameters is easy to carry out.

Abstract: A method of fabricating a clamping device for a flexible substrate is provided. A carrier board is provided. A plurality of holes is formed in the carrier board. A fixed positioning assembly and a movable positioning assembly are respectively embedded in the plurality of holes.

Abstract: A thin film solar cell module of see-through type and method of fabricating the same is provided. The method includes forming scribe lines in two directions in a first electrode material layer disposed on an opaque substrate so as to avoid short circuit caused by a high-temperature laser scribing process and reduction of the process yield. Moreover, the thin film solar cell module of see-through type has holes through the opaque substrate so that the cell module increases the transmittance of the cells.

Abstract: A method of fabricating a clamping device for a flexible substrate is provided. A carrier board having a first positing holes and a plurality of second position holes is provided, wherein the first and the second position holes correspond in position to a plurality of through holes on the flexible substrate. A portion of the carrier board material close to the second position holes is removed to form a hole body and a plurality of curved extending arms connected to the hole body and the carrier board. A first dowel pin and a plurality of second dowel pins are provided for inserting into the first positioning hole and the second positioning holes, respectively.

Abstract: A bifacial thin film solar cell and method for fabricating the same are provided. The solar cell has a first and a second transparent substrates, a first and a second solar cell modules, and an insulating layer. The first solar cell module is formed on the first transparent substrate, and has a metal layer as one of the electrodes of the first solar cell module and as a light reflection layer. The insulating layer is formed on the metal layer of the first solar cell module. The second solar cell module is formed between the insulating layer and the second transparent substrate.

Abstract: The prevent invention discloses a structure of thermal resistive layer and the method of forming the same. The thermal resistive structures, formed on a plastic substrate, comprises a porous layer, formed on said plastic substrate, including a plurality of oxides of hollow structure, and a buffer layer, formed on said porous layer, wherein said porous layer can protect said plastic substrate from damage caused by the heat generated during manufacturing process. With the structure and method disclosed above, making a thin film transistor and forming electronic devices on the plastic substrate in the technology of Low Temperature PolySilicon, i.e. LTPS, without changing any parameters is easy to carry out.

Abstract: A method of fabricating a clamping device for a flexible substrate is provided. A carrier board is provided. A plurality of holes is formed in the carrier board. A fixed positioning assembly and a movable positioning assembly are respectively embedded in the plurality of holes.

Abstract: A method of fabricating a clamping device for a flexible substrate is provided. A carrier board having a first positing holes and a plurality of second position holes is provided, wherein the first and the second position holes correspond in position to a plurality of through holes on the flexible substrate. A portion of the carrier board material close to the second position holes is removed to form a hole body and a plurality of curved extending arms connected to the hole body and the carrier board. A first dowel pin and a plurality of second dowel pins are provided for inserting into the first positioning hole and the second positioning holes, respectively.

Abstract: A transparent solar cell module including a transparent solar cell and an optical transparent substrate is provided. The optical transparent substrate includes an optical filter and a first transparent substrate. The transparent solar cell includes a first electrode, a photoelectric conversion layer, a second electrode, and a second transparent substrate in sequence.

Abstract: A clamping device for a flexible substrate is provided. The clamping device includes a carrier board. The carrier board has a fixed positioning assembly and a plurality of movable positioning assemblies. The fixed positioning assembly and the movable positioning assemblies are disposed in locations that almost correspond to a plurality of through holes on the flexible substrate. The fixed positioning assembly includes a hole body with a positioning hole and a dowel pin. Each movable positioning assembly includes a hole body with a positioning hole, a plurality of curved extending arms and a dowel pin. Each curved extending arm is connected to the hole body and the carrier board and the dowel pin is inserted into the positioning hole.

Abstract: A low temperature poly-silicon thin film element, method of making poly-silicon thin film by direct deposition at low temperature, and the inductively-coupled plasma chemical vapor deposition equipment utilized, wherein the poly-silicon material is induced to crystallize into a poly-silicon thin film at low temperature by means of high density plasma and substrate bias voltage. Furthermore, the atom structure of the poly-silicon thin film is aligned in regular arrangement by making use of the induction layer having optimal orientation and lattice constant close to that of the silicon, thus raising the crystallization quality of the poly-silicon thin film and reducing the thickness of the incubation layer.

Abstract: A bifacial thin film solar cell and method for fabricating the same are provided. The solar cell has a first and a second transparent substrates, a first and a second solar cell modules, and an insulating layer. The first solar cell module is formed on the first transparent substrate, and has a metal layer as one of the electrodes of the first solar cell module and as a light reflection layer. The insulating layer is formed on the metal layer of the first solar cell module. The second solar cell module is formed between the insulating layer and the second transparent substrate.

Abstract: A thin film solar cell module of see-through type and method of fabricating the same is provided. The method includes forming scribe lines in two directions in a first electrode material layer disposed on an opaque substrate so as to avoid short circuit caused by a high-temperature laser scribing process and reduction of the process yield. Moreover, the thin film solar cell module of see-through type has holes through the opaque substrate so that the cell module increases the transmittance of the cells.

Abstract: A method for manufacturing a thin film transistor (“TFT”) device includes providing a substrate, forming a patterned first metal layer on the substrate, forming an insulating layer over the patterned first metal layer, forming an amorphous silicon layer over the insulating layer, forming a first polycrystalline silicon layer over the amorphous silicon layer, forming a second polycrystalline silicon layer over the first polycrystalline silicon layer, doping the second polycrystalline silicon layer to form a doped polycrystalline silicon layer, patterning the amorphous silicon layer, first polycrystalline silicon layer and doped polycrystalline silicon layer to form an active region layer for the TFT device, and forming a patterned second metal layer over the active region layer.