Patents by Inventor Teck Kai Wong

Teck Kai Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LAMINATES BASED ON SAME
    Publication number: 20250115751
    Abstract: This disclosure relates to thermosetting compositions suitable for use in making electronic materials such as circuit board substrates, as well as cured compositions, prepregs and laminates based on such thermosetting compositions. One aspect of the disclosure is a thermosetting composition comprising: an aromatic epoxy resin component; a poly(styrene-co-maleic anhydride) component; a maleimide-bearing oligomer component; the maleimide-bearing oligomer component having an average of at least 4 maleimides per molecule, on a number average, and a softening point of no more than 100° C.; a benzoxazine/maleimide component, that is a bis(benzoxazine) subcomponent and a bis(maleimide) subcomponent, and/or a reaction product thereof; an aromatic primary diamine component; microparticulate silica; an organic halogen-free fire retardant component; an effective amount of one or more catalysts.
    Type: Application
    Filed: October 3, 2024
    Publication date: April 10, 2025
    Inventor: Teck Kai Wong
  • SMA resin formulation
    Patent number: 11891475
    Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: February 6, 2024
    Assignee: Isola USA Corp.
    Inventors: Edward Kelley, Teck Kai Wong, Rebekah F. Theisen, Christopher G. Clark, Jr.
  • SMA Resin Formulation
    Publication number: 20230141772
    Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
    Type: Application
    Filed: June 21, 2022
    Publication date: May 11, 2023
    Inventors: Edward Kelley, Teck Kai Wong, Rebekah F. Theisen, Christopher G. Clark, JR.
  • SMA resin formulation
    Patent number: 11365282
    Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: June 21, 2022
    Assignee: Isola USA Corp.
    Inventors: Edward Kelley, Teck Kai Wong, Rebekah F. Theisen, Christopher G. Clark, Jr.
  • Improved SMA Resin Formulation
    Publication number: 20190270873
    Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
    Type: Application
    Filed: July 25, 2017
    Publication date: September 5, 2019
    Inventors: Edward Kelley, Teck Kai Wong, Rebekah F. Theisen, Christopher G. Clark, Jr.