Patents by Inventor Teck Poh

Teck Poh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10722104
    Abstract: An endoscopy device (1) for facilitating use of an endoscope, comprising at least one airway tube (2) and a mask (3) having a distal end (4), a proximal end (5) and a peripheral formation ??) capable of conforming to, and fitting within, the actual and potential space behind the larynx of the patient to form a seal around the circumference of the laryngeal inlet, the peripheral formation (6) establishing separation between a laryngeal; chamber side (3a) and a pharyngeal side (3b), the device further comprising a conduit (8) adapted for passage of an endoscope into the oesophagus of a patient when mask (3) is in place, conduit (8) including a distal end for cooperation with the oesophageal sphincter, the conduit having a laryngeal side (8d), a pharyngeal side (8c), a right side (8e) and a left side (8f), and an outlet wherein at the outlet the width between the left side and the right side is smaller than the width of the conduit.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: July 28, 2020
    Assignee: TELEFLEX LIFE SCIENCES PTE. LTD.
    Inventors: Sylwia Poulsen, Teck Poh
  • Publication number: 20190117922
    Abstract: A fixation device (8) for use with a laryngeal mask airway device (10), the fixation device (8) comprising releasable locking means (12) for releasably securing the fixation device to the laryngeal mask airway device.
    Type: Application
    Filed: March 31, 2017
    Publication date: April 25, 2019
    Inventors: Sylwia Poulsen, Teck Poh
  • Publication number: 20160192829
    Abstract: An endoscopy device (1) for facilitating use of an endoscope, comprising at least one airway tube (2) and a mask (3) having a distal end (4), a proximal end (5) and a peripheral formation ??) capable of conforming to, and fitting within, the actual and potential space behind the larynx of the patient to form a seal around the circumference of the laryngeal inlet, the peripheral formation (6) establishing separation between a laryngeal; chamber side (3a) and a pharyngeal side (3b), the device further comprising a conduit (8) adapted for passage of an endoscope into the oesophagus of a patient when mask (3) is in place, conduit (8) including a distal end for cooperation with the oesophageal sphincter, the conduit having a laryngeal side (8d), a pharyngeal side (8c), a right side (8e) and a left side (8f), and an outlet wherein at the outlet the width between the left side and the right side is smaller than the width of the conduit.
    Type: Application
    Filed: August 15, 2014
    Publication date: July 7, 2016
    Inventors: Sylwia POULSEN, Teck POH
  • Publication number: 20050287702
    Abstract: A method for designing a carrier substrate includes configuring at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The method may also include configuring the carrier substrate to include one or more recessed areas that laterally surround at least a portion of the die-attach location to receive excess adhesive.
    Type: Application
    Filed: August 29, 2005
    Publication date: December 29, 2005
    Inventors: Cher Victor Tan, Choon Lee, Kian Lee, Guek Lim, Wuu Tay, Teck Poh, Cheng Poh
  • Publication number: 20050029676
    Abstract: A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The solder may be positioned or formed on the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive excess adhesive.
    Type: Application
    Filed: September 7, 2004
    Publication date: February 10, 2005
    Inventors: Cher Tan, Choon Lee, Kian Lee, Guek Lim, Wuu Tay, Teck Poh, Cheng Pour