Patents by Inventor Teck Poh

Teck Poh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10722104
    Abstract: An endoscopy device (1) for facilitating use of an endoscope, comprising at least one airway tube (2) and a mask (3) having a distal end (4), a proximal end (5) and a peripheral formation ??) capable of conforming to, and fitting within, the actual and potential space behind the larynx of the patient to form a seal around the circumference of the laryngeal inlet, the peripheral formation (6) establishing separation between a laryngeal; chamber side (3a) and a pharyngeal side (3b), the device further comprising a conduit (8) adapted for passage of an endoscope into the oesophagus of a patient when mask (3) is in place, conduit (8) including a distal end for cooperation with the oesophageal sphincter, the conduit having a laryngeal side (8d), a pharyngeal side (8c), a right side (8e) and a left side (8f), and an outlet wherein at the outlet the width between the left side and the right side is smaller than the width of the conduit.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: July 28, 2020
    Assignee: TELEFLEX LIFE SCIENCES PTE. LTD.
    Inventors: Sylwia Poulsen, Teck Poh
  • Publication number: 20190117922
    Abstract: A fixation device (8) for use with a laryngeal mask airway device (10), the fixation device (8) comprising releasable locking means (12) for releasably securing the fixation device to the laryngeal mask airway device.
    Type: Application
    Filed: March 31, 2017
    Publication date: April 25, 2019
    Inventors: Sylwia Poulsen, Teck Poh
  • Patent number: 9494747
    Abstract: An optical waveguide has a window for receiving optical signals re-directed by a beam splitter and a heating element associated with the window.
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: November 15, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kian Teck Poh, Jing Kai Tan, Chee How Lee
  • Publication number: 20160192829
    Abstract: An endoscopy device (1) for facilitating use of an endoscope, comprising at least one airway tube (2) and a mask (3) having a distal end (4), a proximal end (5) and a peripheral formation ??) capable of conforming to, and fitting within, the actual and potential space behind the larynx of the patient to form a seal around the circumference of the laryngeal inlet, the peripheral formation (6) establishing separation between a laryngeal; chamber side (3a) and a pharyngeal side (3b), the device further comprising a conduit (8) adapted for passage of an endoscope into the oesophagus of a patient when mask (3) is in place, conduit (8) including a distal end for cooperation with the oesophageal sphincter, the conduit having a laryngeal side (8d), a pharyngeal side (8c), a right side (8e) and a left side (8f), and an outlet wherein at the outlet the width between the left side and the right side is smaller than the width of the conduit.
    Type: Application
    Filed: August 15, 2014
    Publication date: July 7, 2016
    Inventors: Sylwia POULSEN, Teck POH
  • Patent number: 9317075
    Abstract: An example provides an apparatus including a shielding panel in spaced relation to a substrate such that a heat sink mounted on the substrate protrudes through an opening in the shielding panel. A first airflow path may be provided between the substrate and a first side of the shielding panel, and a second airflow path may be provided on a second side of the shielding panel across a portion of the heat sink protruding through the opening.
    Type: Grant
    Filed: April 29, 2013
    Date of Patent: April 19, 2016
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Kah Hoe Ng, Tzye Perng Poh, Kian Teck Poh
  • Patent number: 9247624
    Abstract: A system includes an external light supply to a silicon photonic chip. The light supply includes a primary light source, a secondary light source, an optical coupler, an optical splitter, and a dark sensor. The optical coupler is to combine any output from the primary light source and any output from the secondary light source into an input to the silicon photonic chip. The optical splitter is located in an optical path between the primary light source and the optical coupler, and is to divert part of the output from the primary light source. The dark sensor is to receive the diverted part of the output from the primary light source and to selectively activate the secondary light source based on the diverted part of the output from the primary light source.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: January 26, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Jing Kai Tan, Chee How Lee, Kian Teck Poh
  • Publication number: 20150378115
    Abstract: An optical waveguide has a window for receiving optical signals re-directed by a beam splitter and a heating element associated with the window.
    Type: Application
    Filed: July 16, 2013
    Publication date: December 31, 2015
    Inventors: KIAN TECK POH, JING KAI TAN, CHEE HOW LEE
  • Publication number: 20150370014
    Abstract: Example methods and apparatus to remove dust from an optical waveguide assembly are disclosed. An example apparatus includes a window to be located on an optical waveguide assembly. The example apparatus includes a first piezoelectric member coupled to the window. The first piezoelectric member is to vibrate the window to remove dust from the window in response to an electrical signal.
    Type: Application
    Filed: January 24, 2013
    Publication date: December 24, 2015
    Inventors: Kian Teck POH, Chee How Lee, Jing Kai TAN
  • Patent number: 9130291
    Abstract: In one implementation a device connector includes a first electronic device magnet, second electronic device magnet, and third electronic device magnet to connect to a power supply. The power supply magnet can be oriented to the opposite pole of one of the electronic device magnets.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: September 8, 2015
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.
    Inventors: Kian Teck Poh, Chee How Lee, Jing Kai Tan
  • Patent number: 9025496
    Abstract: A network switching device includes at least two stacking ports, each stacking port being connectable via a stacking cable to a stack including at least one external network switching device. The device further includes an internal communication medium coupled to the stacking ports and capable of transmitting a frequency division multiplexed signal between the stacking ports. The device further includes a network switch and an interface to enable communication between the network switch and the internal communication medium. The interface includes a parallel coupling to the internal communication medium such that a signal with one carrier frequency being communicated between the network switch and the internal communication medium does not interfere with transmission between the two stacking ports of a signal with a different carrier frequency.
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: May 5, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Keng Hua Chuang, Kum Cheong Adam Chan, Kian Teck Poh
  • Publication number: 20140321051
    Abstract: An example provides an apparatus including a shielding panel in spaced relation to a substrate such that a heat sink mounted on the substrate protrudes through an opening in the shielding panel. A first airflow path may be provided between the substrate and a first side of the shielding panel, and a second airflow path may be provided on a second side of the shielding panel across a portion of the heat sink protruding through the opening.
    Type: Application
    Filed: April 29, 2013
    Publication date: October 30, 2014
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kah Hoe Ng, Tzye Perng Poh, Kian Teck Poh
  • Publication number: 20140210354
    Abstract: A system includes an external light supply to a silicon photonic chip. The light supply includes a primary light source, a secondary light source, an optical coupler, an optical splitter, and a dark sensor. The optical coupler is to combine any output from the primary light source and any output from the secondary light source into an input to the silicon photonic chip. The optical splitter is located in an optical path between the primary light source and the optical coupler, and is to divert part of the output from the primary light source. The dark sensor is to receive the diverted part of the output from the primary light source and to selectively activate the secondary light source based on the diverted part of the output from the primary light source.
    Type: Application
    Filed: January 29, 2013
    Publication date: July 31, 2014
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jing Kai Tan, Chee How Lee, Kian Teck Poh
  • Publication number: 20140133490
    Abstract: A network switching device includes at least two stacking ports, each stacking port being connectable via a stacking cable to a stack including at least one external network switching device. The device further includes an internal communication medium coupled to the stacking ports and capable of transmitting a frequency division multiplexed signal between the stacking ports. The device further includes a network switch and an interface to enable communication between the network switch and the internal communication medium. The interface includes a parallel coupling to the internal communication medium such that a signal with one carrier frequency being communicated between the network switch and the internal communication medium does not interfere with transmission between the two stacking ports of a signal with a different carrier frequency.
    Type: Application
    Filed: January 21, 2014
    Publication date: May 15, 2014
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Keng Hua Chuang, Kum Cheong Adam Chan, Kian Teck Poh
  • Publication number: 20140065846
    Abstract: In one implementation a device connector includes a first electronic device magnet, second electronic device magnet, and third electronic device magnet to connect to a power supply. The power supply magnet can be oriented to the opposite pole of one of the electronic device magnets.
    Type: Application
    Filed: August 29, 2012
    Publication date: March 6, 2014
    Inventors: Kian Teck Poh, Chee How Lee, Jing Kai Tan
  • Patent number: 8665704
    Abstract: A network switching device includes at least two stacking ports, each stacking port being connectable via a stacking cable to a stack including at least one external network switching device. The device further includes an internal communication medium coupled to the stacking ports and capable of transmitting a frequency division multiplexed signal between the stacking ports. The device further includes a network switch and an interface to enable communication between the network switch and the internal communication medium. The interface includes a parallel coupling to the internal communication medium such that a signal with one carrier frequency being communicated between the network switch and the internal communication medium does not interfere with transmission between the two stacking ports of a signal with a different carrier frequency.
    Type: Grant
    Filed: November 25, 2011
    Date of Patent: March 4, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Keng Hua Chuang, Kum Cheong Adam Chan, Kian Teck Poh
  • Publication number: 20130136124
    Abstract: A network switching device includes at least two stacking ports, each stacking port being connectable via a stacking cable to a stack including at least one external network switching device. The device further includes an internal communication medium coupled to the stacking ports and capable of transmitting a frequency division multiplexed signal between the stacking ports. The device further includes a network switch and an interface to enable communication between the network switch and the internal communication medium. The interface includes a parallel coupling to the internal communication medium such that a signal with one carrier frequency being communicated between the network switch and the internal communication medium does not interfere with transmission between the two stacking ports of a signal with a different carrier frequency.
    Type: Application
    Filed: November 25, 2011
    Publication date: May 30, 2013
    Inventors: Keng Hua CHUANG, Kum Cheong Adam Chan, Kian Teck Poh
  • Publication number: 20050287702
    Abstract: A method for designing a carrier substrate includes configuring at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The method may also include configuring the carrier substrate to include one or more recessed areas that laterally surround at least a portion of the die-attach location to receive excess adhesive.
    Type: Application
    Filed: August 29, 2005
    Publication date: December 29, 2005
    Inventors: Cher Victor Tan, Choon Lee, Kian Lee, Guek Lim, Wuu Tay, Teck Poh, Cheng Poh
  • Publication number: 20050029676
    Abstract: A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The solder may be positioned or formed on the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive excess adhesive.
    Type: Application
    Filed: September 7, 2004
    Publication date: February 10, 2005
    Inventors: Cher Tan, Choon Lee, Kian Lee, Guek Lim, Wuu Tay, Teck Poh, Cheng Pour
  • Patent number: D791305
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: July 4, 2017
    Assignee: TELEFLEX LIFE SCIENCES UNLIMITED COMPANY
    Inventors: Sylwia Ewa Krol Poulsen, Hian Teck Poh