Patents by Inventor Teck Wah PARK

Teck Wah PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SHRINK PACKAGE ON BOARD
    Publication number: 20100102436
    Abstract: A method of forming a device is disclosed. The method includes providing a printed circuit board substrate having a die attach region on a first surface of the substrate. The method also includes attaching a die to a die attach region. The die is electrically coupled to first land pads disposed on the first surface at the periphery of the die attach region. A cap is formed in a target area by a top gate process to produce a cap with an even surface. The cap covers the die and leaves at least the first land pads exposed.
    Type: Application
    Filed: October 20, 2009
    Publication date: April 29, 2010
    Applicant: United Test and Assembly Center Ltd.
    Inventors: Kian Teng ENG, Rodel MANALAC, Teck Wah PARK, Richard Te GAN