Abstract: In one example, an electronic device includes a module comprising electronic components and a first encapsulant disposed around lateral sides of the electronic components. A substrate is coupled to the module. A metallic structure is coupled to a side of the module opposite the substrate, and the metallic structure is coupled to back sides of the electronic components. A thermal interface material is coupled to the metallic structure. A lid is coupled to the thermal interface material. Other examples and related methods are also disclosed herein.

Abstract: A fingerprint sensor package includes a flat surface having a dielectric protective coating protecting a sensing element of a fingerprint sensor and an electrically conductive bezel that discharges electrostatic discharge (ESD). Both the protective coating and the bezel can be colored to have desired colors. Accordingly, the flat surface can be colored as desired enhancing the attractiveness for consumer applications. Further, light emitting diodes are integrated into the fingerprint sensor package providing a visual feedback to the user that the user's fingerprint has been successfully sensed. Further, the fingerprint sensor package is formed using a high volume low cost assembly technique.