Patents by Inventor Ted Alfonso

Ted Alfonso has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250367435
    Abstract: A method for fabricating a segmented electrode is provided. The method includes performing a series of progressive die stamping operations on a foil sheet of material to form an initial electrode, and removing portions of the initial electrode using a centerless grinding process to form a segmented electrode including a plurality of circumferentially spaced contacts.
    Type: Application
    Filed: June 13, 2025
    Publication date: December 4, 2025
    Inventors: Ted Alfonso, Steve Wheeler, Jeff Urbanski
  • Patent number: 12350487
    Abstract: A method for fabricating a segmented electrode is provided. The method includes performing a series of progressive die stamping operations on a foil sheet of material to form an initial electrode, and removing portions of the initial electrode using a centerless grinding process to form a segmented electrode including a plurality of circumferentially spaced contacts.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: July 8, 2025
    Assignee: Advanced Neuromodulation Systems, Inc.
    Inventors: Ted Alfonso, Steve Wheeler, Jeff Urbanski
  • Publication number: 20230256235
    Abstract: A method for fabricating a segmented electrode is provided. The method includes performing a series of progressive die stamping operations on a foil sheet of material to form an initial electrode, and removing portions of the initial electrode using a centerless grinding process to form a segmented electrode including a plurality of circumferentially spaced contacts.
    Type: Application
    Filed: February 16, 2022
    Publication date: August 17, 2023
    Inventors: Ted Alfonso, Steve Wheeler, Jeff Urbanski
  • Publication number: 20220143411
    Abstract: The present disclosure provides systems and methods for a conductor assembly for an implantable lead cable. The conductor assembly includes a conductive element extending over an axial length from a proximal end to a distal end. The conductor assembly includes an inner dielectric layer coaxially covering the conductive element over the axial length. The conductor assembly includes an inner conductive layer coaxially covering the inner dielectric layer over the axial length, the inner conductive layer comprising a contiguous metal coating having a thickness in a range of 1 to 50 microns.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 12, 2022
    Inventors: Jeffrey Urbanski, Ted Alfonso, John Gonzalez