Abstract: A method for manufacturing a surface mount solder pad that is adapted to function as a heat sink for an electronic component soldered to the pad. The method comprises a step of providing a printed wiring board having a conductive layer disposed thereon. The method further comprises a step of selecting a size and arrangement of regions of a solder pad so as to sink sufficient heat. The method also comprises removing non-selected regions of the conductive layer to produce solder pads on the surface of the printed wiring board enhanced with features that promote heat transfer to sink enough heat generated by one of the surface mount components to provide for its proper operation.

Abstract: A battery management system and method for an electronic device that may be powered by an AC source (using an AC adapter), or by a battery. The battery management system includes firmware configured to determine whether a battery coupled to the electronic device is rechargeable. The firmware is also coupled to and configured to control a charge switch. When the battery and an AC source are both coupled to the device, activating the charge switch causes a charging current to be applied from the AC source to the battery. The charge switch and firmware are configured to cause the charging current to not be applied to the battery if it is determined that the battery is not rechargeable.

Abstract: A surface mount solder pad that is adapted to function as a heat sink for an electronic component soldered to the pad. Included is a printed wiring board having solder pads disposed on its surface that are adapted for soldering to leads of surface mount components. The solder pads are electrically interconnected by conductive traces also disposed on the surface. At least one of the solder pads has an enhanced surface area that is selected larger than necessary for the soldering, and that is selected sufficiently large so as to sink enough heat generated by one of the surface mount components to provide for its proper operation.