Abstract: A packet switch appliance for connection to a packet switching network, the packet switch appliance has a motherboard that includes a processor, a network switch chip, and a connector. The packet switch appliance also includes a daughter board configured to be removably connected to the motherboard through the connector. The daughter board may include one or more of a network switch chip and a processor unit.

Abstract: The present invention relates to a packet switch and a packet switching method. An example embodiment of the present invention comprises at least three network ports, at least one instrument port, a mux-switch, a packet switch fabric, and an address table. The embodiment updates the address table to include the source address of each ingress packet of each network port and associate the source address with that network port. The mux-switch routes the ingress packet traffic of each network port according to the identity of the network port so that at least a copy of the packet traffic of one of the network ports is routed to an instrument port. The packet switch fabric routes the packets from the instrument ports to the network ports according the destination address of the packet and the identity of the network port that is associated with the destination address as recorded in the address table.

Abstract: A packet switch appliance for connection to a packet switching network, the packet switch appliance has a motherboard that includes a processor, a network switch chip, and a connector. The packet switch appliance also includes a daughter board configured to be removably connected to the motherboard through the connector. The daughter board may include one or more of a network switch chip and a processor unit.

Abstract: A packet switch appliance for connection to a packet switching network, the packet switch appliance has a motherboard that includes a processor, a network switch chip, and a connector. The packet switch appliance also includes a daughter board configured to be removably connected to the motherboard through the connector. The daughter board may include one or more of a network switch chip and a processor unit.

Abstract: The present invention relates to a packet switch and a packet switching method. An example embodiment of the present invention comprises at least three network ports, at least one instrument port, a mux-switch, a packet switch fabric, and an address table. The embodiment updates the address table to include the source address of each ingress packet of each network port and associate the source address with that network port. The mux-switch routes the ingress packet traffic of each network port according to the identity of the network port so that at least a copy of the packet traffic of one of the network ports is routed to an instrument port. The packet switch fabric routes the packets from the instrument ports to the network ports according the destination address of the packet and the identity of the network port that is associated with the destination address as recorded in the address table.

Abstract: A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner cylinder-shaped conductor is disposed in the outer cylinder-shaped conductor and also extends along the first direction. The intermediate fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor and is made of insulating material or electrical-resistant material. The coaxial via hole structure can be applied as a capacitor or a resistor and has the function of signal shielding.

Abstract: A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner cylinder-shaped conductor is disposed in the outer cylinder-shaped conductor and also extends along the first direction. The intermediate fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor and is made of insulating material or electrical-resistant material. The coaxial via hole structure can be applied as a capacitor or a resistor and has the function of signal shielding.

Abstract: A packaging structure with low switching noises is disclosed. In this structure, a chip capacitor is connected to a chip. The chip capacitor is a capacitor structure formed using a high dielectric material to provide a better noise filtering effect. Therefore, the invention can effectively lower switching noises.

Abstract: A packaging structure with low switching noises is disclosed. In this structure, a chip capacitor is connected to a chip. The chip capacitor is a capacitor structure formed using a high dielectric material to provide a better noise filtering effect. Therefore, the invention can effectively lower switching noises.

Abstract: An electrical-resistant via hole structure used in a carrier is disclosed. The electrical-resistant via hole includes a via hole and electrical-resistant material. The via hole is in the carrier and extends along a first direction. The electrical-resistant material is placed into the via hole and contacts with first and second conductors. The assembly consisting of a first conductor, electrical-resistant material, and second conductor composes a resistor. The electrical-resistant via hole of the invention needs less area and reduces the size of PCBs.

Abstract: A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner cylinder-shaped conductor is disposed in the outer cylinder-shaped conductor and also extends along the first direction. The intermediate fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor and is made of insulating material or electrical-resistant material. The coaxial via hole structure can be applied as a capacitor or a resistor and has the function of signal shielding.

Abstract: An IC dice mounted on a substrate carrier wherein the IC dice is connected by a plurality of bonding wires to a plurality of corresponding bonding pads on the substrate carrier. The wire bonding layout configuration of the electronic device is improved in the present invention by providing centralized consolidated common voltage pads or bars such that the electric wires connecting the bonding pads to external interface contact points, e.g., the ball grid array (BGA) may be shortened. Additionally, the access widow for wire bonding to the IC dice may be broadened.