Patents by Inventor Ted Carper

Ted Carper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free solder alloys and methods of making same
    Publication number: 20040258556
    Abstract: According to one aspect of the invention, a modified Sn—Ag—Cu, lead-free solder alloy is disclosed. The alloy comprises an additive element selected from the group consisting of Au, Ni, Pd, Fe, Co, Zn, Cr and combinations thereof, present in the alloy in an amount effect to form an intermetallic interface between the alloy a substrate, the intermetallic interface having a composite structure without scallop formation and including Sn islands.
    Type: Application
    Filed: October 2, 2003
    Publication date: December 23, 2004
    Applicants: Nokia Corporation, Board of Regents, University of Texas System
    Inventors: Choong-Un Kim, Jae-Yong Park, Rajendra R. Kabade, Ted Carper, Steven Dunford, Viswanadham Puligandla