Patents by Inventor Ted Dziura

Ted Dziura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7826071
    Abstract: A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters.
    Type: Grant
    Filed: October 8, 2007
    Date of Patent: November 2, 2010
    Assignee: KLA-Tencor Corporation
    Inventors: Andrei V. Shchegrov, Anatoly Fabrikant, Mehrdad Nikoonahad, Ady Levy, Daniel C. Wack, Noah Bareket, Walter Mieher, Ted Dziura
  • Publication number: 20090135416
    Abstract: A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters.
    Type: Application
    Filed: October 8, 2007
    Publication date: May 28, 2009
    Applicant: KLA-Tencor Technologies Corporation
    Inventors: Andrei V. Shchegrov, Anatoly Fabrikant, Mehrdad Nikoonahad, Ady Levy, Daniel C. Wack, Noah Bareket, Walter Mieher, Ted Dziura
  • Patent number: 7280230
    Abstract: A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: October 9, 2007
    Assignee: KLA-Tencor Technologies Corporation
    Inventors: Andrei V. Shchegrov, Anatoly Fabrikant, Mehrdad Nikoonahad, Ady Levy, Daniel C. Wack, Noah Bareket, Walter Mieher, Ted Dziura
  • Publication number: 20040070772
    Abstract: A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters.
    Type: Application
    Filed: December 19, 2002
    Publication date: April 15, 2004
    Inventors: Andrei V. Shchegrov, Anatoly Fabrikant, Mehrdad Nikoonahad, Ady Levy, Daniel C. Wack, Noah Bareket, Walter Mieher, Ted Dziura