Patents by Inventor Ted E. Cook

Ted E. Cook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-component strain-inducing semiconductor regions
    Patent number: 8154087
    Abstract: A multi-component strain-inducing semiconductor region is described. In an embodiment, formation of such a strain-inducing semiconductor region laterally adjacent to a crystalline substrate results in a uniaxial strain imparted to the crystalline substrate, providing a strained crystalline substrate. In one embodiment, the multi-component strain-inducing material region comprises a first portion and a second portion which are separated by an interface. In a specific embodiment, the concentration of charge-carrier dopant impurity atoms of the two portions are different from one another at the interface.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: April 10, 2012
    Assignee: Intel Corporation
    Inventors: Ted E. Cook, Jr., Bernhard Sell, Anand Murthy
  • MULTI-COMPONENT STRAIN-INDUCING SEMICONDUCTOR REGIONS
    Publication number: 20110215375
    Abstract: A multi-component strain-inducing semiconductor region is described. In an embodiment, formation of such a strain-inducing semiconductor region laterally adjacent to a crystalline substrate results in a uniaxial strain imparted to the crystalline substrate, providing a strained crystalline substrate. In one embodiment, the multi-component strain-inducing material region comprises a first portion and a second portion which are separated by an interface. In a specific embodiment, the concentration of charge-carrier dopant impurity atoms of the two portions are different from one another at the interface.
    Type: Application
    Filed: May 13, 2011
    Publication date: September 8, 2011
    Inventors: Ted E. Cook, JR., Bernhard Sell, Anand Murthy
  • Multi-component strain-inducing semiconductor regions
    Patent number: 7943469
    Abstract: A multi-component strain-inducing semiconductor region is described. In an embodiment, formation of such a strain-inducing semiconductor region laterally adjacent to a crystalline substrate results in a uniaxial strain imparted to the crystalline substrate, providing a strained crystalline substrate. In one embodiment, the multi-component strain-inducing material region comprises a first portion and a second portion which are separated by an interface. In a specific embodiment, the concentration of charge-carrier dopant impurity atoms of the two portions are different from one another at the interface.
    Type: Grant
    Filed: November 28, 2006
    Date of Patent: May 17, 2011
    Assignee: Intel Corporation
    Inventors: Ted E. Cook, Jr., Bernhard Sell, Anand Murthy
  • Multi-component strain-inducing semiconductor regions
    Publication number: 20080124878
    Abstract: A multi-component strain-inducing semiconductor region is described. In an embodiment, formation of such a strain-inducing semiconductor region laterally adjacent to a crystalline substrate results in a uniaxial strain imparted to the crystalline substrate, providing a strained crystalline substrate. In one embodiment, the multi-component strain-inducing material region comprises a first portion and a second portion which are separated by an interface. In a specific embodiment, the concentration of charge-carrier dopant impurity atoms of the two portions are different from one another at the interface.
    Type: Application
    Filed: November 28, 2006
    Publication date: May 29, 2008
    Inventors: Ted E. Cook, Bernhard Sell, Anand Murthy