Abstract: A film including a first surface and an opposite second surface. A first layer includes the first surface. A second layer arranged onto the first layer includes the second surface. The second layer includes thermally activatable material. In a thermal activation process, wherein the temperature of the thermally activatable material rises above an activation temperature, adhesion properties of the material change such that before thermal activation, material of the second layer is solid and non-sticky, and after thermal activation, material of the second layer is viscous and forms an active adhesive. The first layer includes material that is resistant to temperatures higher than the activation temperature. Material of the first layer, material of the second layer, or the film including the first and second layers is capable of absorbing electromagnetic energy. An item including a body labelled with the film. A method for labelling a body using the film.

Abstract: A printable laminate label and a printed self-adhesive laminate label woundable to a roll. An apparatus for providing a linerless label and a method for providing a linerless label. A label according to an embodiment includes a face stock, an adhesive layer and a release liner. The release liner is releasably attached to a surface of the adhesive layer and an opposing surface of the adhesive layer is attached to a release layer. The release layer is attached to a surface of the face stock, and an opposing surface of the face stock comprises a printable surface. The adhesive layer is detachable from the release layer attached to the surface of the face stock and attachable on a printed surface of the face stock.

Abstract: This invention relates to molded plastic article having an in-mold label comprising radio frequency identification (RFID) device, and methods of in-mold labeling. In one embodiment of the invention, an RFID label comprises an RFID inlay and a substrate underneath the RFID inlay. The substrate includes a first surface and a second surface, with the RFID inlay disposed on the first surface. A primer is applied to the first surface including the inlay and the second surface of the substrate. A polymer cover is applied over the primer on the first surface and the second surface using slot die coating.