Abstract: A magnetic component for an electronic circuit includes a core having a core body and a core leg extending from the core body. The core body defines a core body height, and the core leg defines a core leg height less than the core body height. A conductive winding is positioned about the core leg. The winding defines a winding height. A winding height offset ratio is defined as the winding height divided by the core body height. In some embodiments the winding height offset ratio is less than about 1.1. The winding can be positioned on a bobbin structure disposed about the core leg. The magnetic component can be positioned in an enclosure to form an electronic device such as a power control or a power supply, and a thermally conductive gap-filler can be positioned between the magnetic component and the enclosure wall to dissipate heat from the magnetic component.

Abstract: A magnetic component for an electronic circuit includes a core having one or more core surface grooves defined on a side wall, an end wall or both, along the outer core perimeter. Each core surface groove can improve heat flux away from the magnetic component. In some embodiments, a thermally conductive gap filler material is disposed adjacent one or more of the core surface grooves. An electronic device includes a magnetic component with one or more core surface grooves positioned on a circuit board inside an enclosure. The gap filler material spans a gap between the magnetic component and an enclosure wall interior surface, thereby providing a thermal bridge between the component and the enclosure facilitating heat flux away from the core to the enclosure wall.

Abstract: A mounting apparatus for a light emitting diode module provides a support structure for attaching a light emitting diode module directly to a light bulb in a lighting system. A bulb bracket includes a bulb clip that can be mechanically attached to a conventional bulb such as a fluorescent, neon or incandescent light bulb. A light emitting diode module can be secured to the bulb bracket using a module clip or another attachment disposed between the bracket and the module. Additional light emitting diode support structures include a mounting bar securable directly to a light bulb or other structure in a lighting system such as a sign box wall. An expandable support bracket is also provided for supporting one or more light emitting diode modules.

Abstract: A mounting apparatus for a light emitting diode module provides a support structure for attaching a light emitting diode module directly to a light bulb in a lighting system. A bulb bracket includes a bulb clip that can be mechanically attached to a conventional bulb such as a fluorescent, neon or incandescent light bulb. A light emitting diode module can be secured to the bulb bracket using a module clip or another attachment means disposed between the bracket and the module. Additional light emitting diode support structures include a mounting bar securable directly to a light bulb or other structure in a lighting system such as a sign box wall. An expandable support bracket is also provided for supporting one or more light emitting diode modules. A method of retrofitting a lighting system to use a light emitting diode module is also provided.