Patents by Inventor Ted Ko

Ted Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of improving surface mobility before electroplating
    Publication number: 20040196697
    Abstract: The present invention provides a method of improving surface mobility of a metal seed layer on a wafer before electroplating comprising applying a solvent to a surface of the metal seed layer.
    Type: Application
    Filed: April 3, 2003
    Publication date: October 7, 2004
    Inventors: Ted Ko, Ming-Hsing Tsai