Abstract: A method of monitoring an electrical device includes receiving an operational condition of an electrical device, receiving a measurement indicative of a thermal parameter of the electrical device corresponding to the operational condition, and storing the measurement in memory in association with the operational condition. A system for monitoring electrical devices includes a processor communicative with a memory and the memory has instructions recorded thereon that, when read by the processor, cause the processor to execute the method.

Abstract: A method of monitoring an electrical device includes receiving an operational condition of an electrical device, receiving a measurement indicative of a thermal parameter of the electrical device corresponding to the operational condition, and storing the measurement in memory in association with the operational condition. A system for monitoring electrical devices includes a processor communicative with a memory and the memory has instructions recorded thereon that, when read by the processor, cause the processor to execute the method.

Abstract: A monitoring system includes a calibrated micro-electro-mechanical structure (MEMS) matrix in communication with a controller. The MEMS matrix includes MEMS elements of various sizes which create a continuum of vibration-stress-resistant elements. The MEMS elements will flex in response to flexing of a printed circuit board due to mechanical vibration until failure occurs. The controller monitors the continuity of the MEMS matrix to determine which elements of the MEMS matrix have failed to accurately determine the accumulated vibration stress experienced by the printed circuit board.

Abstract: An example solid state switching arrangement includes at least one bus bar configured to carry electrical current and at least one switch that is silicon carbide based. The switch is secured relative to the bus bar and the bus bar is configured to communicate thermal energy away from the switch. An example method of arranging a switch includes mounting a silicon carbide based switch relative to a bus bar and communication thermal energy away from the silicon carbide based switch using the bus bar.

Abstract: A monitoring system includes a monitor chip or chips soldered to a printed wiring board. By mirroring a function IC chip interface with the monitor chip, the consumed and remaining thermal/and or vibration-fatigue life of the function IC chip based on the life-environment actually experienced through monitoring of the monitor chip is readily determined. The monitor chip includes monitoring interconnections and/or circuitry which determines the number and/or location of failed-open solder terminations of the monitor chip.

Abstract: A solid state switching arrangement includes at least one bus bar configured to carry electrical current and at least one switch that is gallium nitride based. The switch is secured relative to the bus bar and the bus bar is configured to communicate heat away from the switch. An example method of arranging a switch includes mounting a gallium nitride based switch relative to a bus bar and communication heat away from the gallium nitride based switch using the bus bar.

Abstract: A power distribution system has a bus bar and a gallium nitride based semiconductor switch interrupting the bus bar. A controller is electrically coupled to, and controlling, the semiconductor switch.

Abstract: A monitoring system includes a calibrated micro-electro-mechanical structure (MEMS) matrix in communication with a controller. The MEMS matrix includes MEMS elements of various sizes which create a continuum of vibration-stress-resistant elements. The MEMS elements will flex in response to flexing of a printed circuit board due to mechanical vibration until failure occurs. The controller monitors the continuity of the MEMS matrix to determine which elements of the MEMS matrix have failed to accurately determine the accumulated vibration stress experienced by the printed circuit board.

Abstract: A monitoring system includes a calibrated micro-electro-mechanical structure (MEMS) matrix in communication with a controller. The MEMS matrix includes MEMS elements of various sizes which create a continuum of vibration-stress-resistant elements. The MEMS elements will flex in response to flexing of a printed circuit board due to mechanical vibration until failure occurs. The controller monitors the continuity of the MEMS matrix to determine which elements of the MEMS matrix have failed to accurately determine the accumulated vibration stress experienced by the printed circuit board.

Abstract: An example solid state switching arrangement includes at least one bus bar configured to carry electrical current and at least one switch that is silicon carbide based. The switch is secured relative to the bus bar and the bus bar is configured to communicate thermal energy away from the switch. An example method of arranging a switch includes mounting a silicon carbide based switch relative to a bus bar and communication thermal energy away from the silicon carbide based switch using the bus bar.

Abstract: A monitoring system includes a monitor chip or chips soldered to a printed wiring board. By mirroring a function IC chip interface with the monitor chip, the consumed and remaining thermal/and or vibration-fatigue life of the function IC chip based on the life-environment actually experienced through monitoring of the monitor chip is readily determined. The monitor chip includes monitoring interconnections and/or circuitry which determines the number and/or location of failed-open solder terminations of the monitor chip.

Abstract: A monitoring system includes a monitor chip or chips soldered to a printed wiring board. By mirroring a function IC chip interface with the monitor chip, the consumed and remaining thermal/and or vibration-fatigue life of the function IC chip based on the life-environment actually experienced through monitoring of the monitor chip is readily determined. The monitor chip includes monitoring interconnections and/or circuitry which determines the number and/or location of failed-open solder terminations of the monitor chip.

Abstract: A system and method that provides early warning of a capacitor failure before it causes a functional failure by including a plurality of redundant capacitive elements arranged in parallel in a capacitor module. A monitor measures a value corresponding to the total capacitance of the module under a selected system operating condition to obtain a baseline value. During system operation, the monitor compares a measured value with the baseline. If any of the capacitive elements in the module fails in an open state or a shorted state, the measured value will differ respect to the baseline, but the remaining capacitive elements allow the system to continue to operate. The user can therefore replace the failed capacitor as part of scheduled maintenance, reducing maintenance and operating costs caused by unexpected, unscheduled maintenance.

Abstract: An electric device includes an electric element, such as a wound film capacitor, with power input and output leads. The electric element includes a coating layer of parylene that provides moisture resistance and low gas and moisture permeability to protect the electric element from short and long term moisture degradation effects. A known case layer is located adjacent to the coating layer. The case layer is a metal, epoxy-based, silicone-based, or polymer material that encapsulates the coating layer and the electric element to protect the coating layer and electric element from physical damage.

Abstract: A monitoring system includes a monitor chip or chips soldered to a printed wiring board. By mirroring a function IC chip interface with the monitor chip, the consumed and remaining thermal/and or vibration-fatigue life of the function IC chip based on the life-environment actually experienced through monitoring of the monitor chip is readily determined. The monitor chip includes monitoring interconnections and/or circuitry which determines the number and/or location of failed-open solder terminations of the monitor chip.

Abstract: A monitoring system includes a calibrated micro-electro-mechanical structure (MEMS) matrix in communication with a controller. The MEMS matrix includes MEMS elements of various sizes which create a continuum of vibration-stress-resistant elements. The MEMS elements will flex in response to flexing of a printed circuit board due to mechanical vibration until failure occurs. The controller monitors the continuity of the MEMS matrix to determine which elements of the MEMS matrix have failed to accurately determine the accumulated vibration stress experienced by the printed circuit board.