Abstract: A digital audio processing system determines characteristics of an electronic presentation to generate a musical composition that is unique to the electronic presentation by adjoining digital audio stems in accordance with the characteristics of the electronic presentation. Embodiments enable a user to define an order for displaying images and a level of importance of the images with respect to one another. For example, the user may designate a specific one of the multiple images as a “highlight image” for emphasizing during the electronic presentation. Then, the system may arrange numerous musical segments adjacent to one another so that the intensity (e.g., energy level) of a resulting musical composition coincides with key events (e.g., a highlight image being shown) of the particular electronic presentation. The intensity of a particular musical segment may indicate a relative note structure density as compared to other musical segments that are defined within the stem data.

Abstract: A digital audio processing system determines characteristics of an electronic presentation to generate a musical composition that is unique to the electronic presentation by adjoining digital audio stems in accordance with the characteristics of the electronic presentation. Embodiments enable a user to define an order for displaying images and a level of importance of the images with respect to one another. For example, the user may designate a specific one of the multiple images as a “highlight image” for emphasizing during the electronic presentation. Then, the system may arrange numerous musical segments adjacent to one another so that the intensity (e.g., energy level) of a resulting musical composition coincides with key events (e.g., a highlight image being shown) of the particular electronic presentation. The intensity of a particular musical segment may indicate a relative note structure density as compared to other musical segments that are defined within the stem data.

Abstract: A dielectric layer in a wiring substrate having a sloped sidewall. A photomask used to pattern the dielectric layer includes optical proximity features. The size and spacing of the optical proximity features are generally less than the resolution limit of the exposure tool used and do not print out on the layer. The optical proximity features provide a transition region between fully exposed material and un-exposed material, which results in a sloped sidewall of the photo-sensitive material after development. The sloped sidewall provides a more reliable thin film metal layer to contact through vias, and may be used to conserve wiring board area by allowing smaller via spacing.

Abstract: A method for forming a planarized thin film dielectric film on a surface of a common circuit base upon which one or more integrated circuits are to be attached. The common circuit base includes raised features formed over its surface such that the raised features define a trench area between them. The method includes the steps of forming a first layer of the dielectric film over the common circuit base and over the raised features and the trench, then patterning the newly formed layer to remove portions of the layer formed over the raised features and expose the raised features. After the layer is patterned, formation of the dielectric film is completed by forming a second layer of the dielectric film over the patterned first layer.