Abstract: A projector includes a housing, an optical unit, and a heat transfer module. The housing is made of a material with high thermal conductivity having a window. The optical unit is accommodated in the housing and further includes a light source, a panel, and a projection lens. The light source provides a light. The panel modulates the light. The projection lens projects the modulated light to leave the window. The heat transfer module is accommodated in the housing and connected the optical unit and the housing to transfer heat from the optical unit to the housing. Particularly, the projector is a cooling-fan saved projector. In addition, the projector further comprises a computer card adapter and a computer card inserted into the computer card adapter.

Abstract: A head-mounted display apparatus for a first external video source and a second external video source includes a support, an optical unit, a receiver, and a micro controller. The support is to be worn on a user's head. The optical unit displays video for the user. The receiver selectively receives video signals provided from the first external video source or the second external video source. The micro controller is electrically connected to the receiver for processing the signal to control the optical unit to display the video.

Abstract: A cooling system for cooling an interface card is provided. The cooling system comprises a thermal conductive housing wrapping around a carrier of the interface card and the electronic devices thereon. A pair of fans are set up on the housing to provide a flow of air inside the space between the housing and the carrier so that the heat generated by the operating devices are rapidly carried away. In addition, a fin type heat sink can be incorporated into the space between the housing and the electronic devices to increase the amount of heat transferred away from the operating devices.

Abstract: A cooling system for cooling an interface card is provided. The cooling system comprises a thermal conductive housing wrapping around a carrier of the interface card and the electronic devices thereon. A pair of fans are set up on the housing to provide a flow of air inside the space between the housing and the carrier so that the heat generated by the operating devices are rapidly carried away. In addition, a fin type heat sink can be incorporated into the space between the housing and the electronic devices to increase the amount of heat transferred away from the operating devices.