Patents by Inventor Ted Tessitore

Ted Tessitore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coating on PDC/TSP cutter for accelerated leaching
    Patent number: 9776917
    Abstract: A cutting element includes a polycrystalline diamond layer having a cutting face and a diamond layer side surface, a substrate attached to the polycrystalline diamond layer, the substrate having a bottom surface and a substrate side surface, an interface between the diamond layer and the substrate, and a mask covering at least the bottom surface and the substrate side surface of the cutting element.
    Type: Grant
    Filed: July 17, 2015
    Date of Patent: October 3, 2017
    Assignee: SMITH INTERNATIONAL, INC.
    Inventors: Ted Tessitore, Anthony Griffo, Yuelin Shen, Youhe Zhang, Madapusi K. Keshavan
  • COATING ON PDC/TSP CUTTER FOR ACCELERATED LEACHING
    Publication number: 20150321952
    Abstract: A cutting element includes a polycrystalline diamond layer having a cutting face and a diamond layer side surface, a substrate attached to the polycrystalline diamond layer, the substrate having a bottom surface and a substrate side surface, an interface between the diamond layer and the substrate, and a mask covering at least the bottom surface and the substrate side surface of the cutting element.
    Type: Application
    Filed: July 17, 2015
    Publication date: November 12, 2015
    Inventors: Ted Tessitore, Anthony Griffo, Yuelin Shen, Youhe Zhang, Madapusi K. Keshavan
  • COATING ON PDC/TSP CUTTER FOR ACCELERATED LEACHING
    Publication number: 20120247841
    Abstract: A cutting element that includes a polycrystalline diamond layer having a cutting face and a diamond layer side surface, a substrate attached to the polycrystalline diamond layer, the substrate having a bottom surface and a substrate side surface, an interface between the diamond layer and the substrate, and a mask covering at least the bottom surface and the substrate side surface of the cutting element is disclosed.
    Type: Application
    Filed: March 28, 2012
    Publication date: October 4, 2012
    Applicant: SMITH INTERNATIONAL INC.
    Inventors: Ted Tessitore, Anthony Griffo, Yuelin Shen, Youhe Zhang, Madapusi K. Keshavan