Abstract: Disclosed is a semiconductor package characterized by having at least one cavity defined in a substrate and at least one buffer pad disposed in the at least one cavity. The semiconductor package includes a semiconductor chip disposed on the substrate, at least one conductive trace connecting with the buffer pad and at least one bonding wire electrically connecting the semiconductor chip to the buffer pad. The buffer pad has a thickness larger than the thickness of the conductive trace.

Abstract: Disclosed is a semiconductor package characterized by having at least one cavity defined in a substrate and at least one buffer pad disposed in the at least one cavity. The semiconductor package includes a semiconductor chip disposed on the substrate, at least one conductive trace connecting with the buffer pad and at least one bonding wire electrically connecting the semiconductor chip to the buffer pad. The buffer pad has a thickness larger than the thickness of the conductive trace.

Abstract: An alloy composition used in the manufacture of extension cables, comprises by weight 25.00% to 35.00% of nickel, 0.10% to 1.00% of manganese, 0.10% to 1.75% of cobalt, less than 0.25% of iron, and the balance being of copper. A thermoelement, of a thermocouple extension cable, manufactured from this composition exhibits a resistivity of approximately 240 ohms per circular mil foot. Hence, the loop resistivity of the cable, where the other thermoelement is made from copper, is generally less than 310 ohms per circular mil foot and the calibration accuracy of the cable from 0.degree. to 100.degree. C. is within .+-.2.5.degree. C.