Patents by Inventor Ted Wang

Ted Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120175432
    Abstract: A paint delivery system (10) for delivering paint to a spraying device (34). The paint delivery system (10) includes a launch station (42) connected by a flow line (52) to an arrival station (44) and one or more shuttles. Paint and the one or more shuttles are transmitted from the launch station (42) to the arrival station (44) and the paint is delivered from the arrival station (44) to the spraying device (34). After the paint is delivered to the spraying device (34), the one or more shuttles are returned to the launch station (42) through the flow line (52). In one or more embodiments, the paint transmitted from the launch station (42) is followed or preceded by a predetermined amount of solvent disposed between two shuttles.
    Type: Application
    Filed: December 22, 2009
    Publication date: July 12, 2012
    Applicant: ABB INC.
    Inventors: Dragoslav Kosta Milojevic, Christopher M. Rennie, Gary J. Ciarelli, Tianjian Ted Wang
  • Patent number: 6770979
    Abstract: Disclosed is a semiconductor package characterized by having at least one cavity defined in a substrate and at least one buffer pad disposed in the at least one cavity. The semiconductor package includes a semiconductor chip disposed on the substrate, at least one conductive trace connecting with the buffer pad and at least one bonding wire electrically connecting the semiconductor chip to the buffer pad. The buffer pad has a thickness larger than the thickness of the conductive trace.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: August 3, 2004
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventors: Chi Tsung Chiu, Ted Wang, Samuel Wu, Jenny Chen
  • Publication number: 20040017007
    Abstract: Disclosed is a semiconductor package characterized by having at least one cavity defined in a substrate and at least one buffer pad disposed in the at least one cavity. The semiconductor package includes a semiconductor chip disposed on the substrate, at least one conductive trace connecting with the buffer pad and at least one bonding wire electrically connecting the semiconductor chip to the buffer pad. The buffer pad has a thickness larger than the thickness of the conductive trace.
    Type: Application
    Filed: March 24, 2003
    Publication date: January 29, 2004
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi Tsung Chiu, Ted Wang, Samuel Wu, Jenny Chen
  • Patent number: 5437745
    Abstract: An alloy composition used in the manufacture of extension cables, comprises by weight 25.00% to 35.00% of nickel, 0.10% to 1.00% of manganese, 0.10% to 1.75% of cobalt, less than 0.25% of iron, and the balance being of copper. A thermoelement, of a thermocouple extension cable, manufactured from this composition exhibits a resistivity of approximately 240 ohms per circular mil foot. Hence, the loop resistivity of the cable, where the other thermoelement is made from copper, is generally less than 310 ohms per circular mil foot and the calibration accuracy of the cable from 0.degree. to 100.degree. C. is within .+-.2.5.degree. C.
    Type: Grant
    Filed: March 25, 1994
    Date of Patent: August 1, 1995
    Assignee: Thermo Electric Corporation
    Inventors: Douglas E. Frank, Ted Wang
  • Patent number: D522372
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: June 6, 2006
    Assignee: Method Products, Inc.
    Inventors: Ted Wang, Karim Rashid
  • Patent number: D541661
    Type: Grant
    Filed: March 6, 2006
    Date of Patent: May 1, 2007
    Assignee: Method Products, Inc.
    Inventors: Ted Wang, Karim Rashid
  • Patent number: D550092
    Type: Grant
    Filed: February 7, 2007
    Date of Patent: September 4, 2007
    Assignee: Method Products, Inc.
    Inventors: Ted Wang, Karim Rashid