Patents by Inventor Teddy Xiong

Teddy Xiong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7153163
    Abstract: A magnetically coupled RJ-45 modular jack assembly for Ethernet applications including a coil pack comprised of a plurality of magnetic circuits. Various numbers of the magnetic circuits may be coupled together in series by way of a variety of wires which may then be soldered directly to a printed circuit board. In order to increase the robustness of the magnetic circuit connection, each group of magnetic circuits coupled together in series, may be encapsulated in an encapsulation material. Additionally, during encapsulation, numerous of the groups of magnet circuits may be encapsulated allowing a plurality of magnetic series to be grouped together further increasing the robustness of the magnetic circuits. Encapsulated coil sets (196, 198) may be fitted together (FIG. 10) and located in notch (190) in the printed circuit board.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: December 26, 2006
    Assignee: Tyco Electronics Corporation
    Inventors: Daniel R. Lewis, Teddy Xiong, Kenneth Koon Keung Lai
  • Publication number: 20040012933
    Abstract: A magnetically coupled RJ-45 modular jack assembly for Ethernet applications including a coil pack comprised of a plurality of magnetic circuits. Various numbers of the magnetic circuits may be coupled together in series by way of a variety of wires which may then be soldered directly to a printed circuit board. In order to increase the robustness of the magnetic circuit connection, each group of magnetic circuits coupled together in series, may be encapsulated in an encapsulation material. Additionally, during encapsulation, numerous of the groups of magnet circuits may be encapsulated allowing a plurality of magnetic series to be grouped together further increasing the robustness of the magnetic circuits.
    Type: Application
    Filed: July 16, 2002
    Publication date: January 22, 2004
    Inventors: Daniel R. Lewis, Teddy Xiong, Kenneth Koon Keung Lai