Patents by Inventor Tee Jong Hui

Tee Jong Hui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080179790
    Abstract: A method to form a high strength moulded product is provided. The method begins by preparing a mouldable composition. The mouldable composition comprises between about 40 to 60 wt % of a fibre mixture and between about 15 to 45 wt % of an adhesive. A mould cavity is loaded with the mouldable composition up to about 90 % of the capacity of the mould cavity before applying a packing pressure of between about 435 to 870 psi to the mouldable composition. A predetermined clearance of between about 0.1 to 0.5 mm is maintained between a first mould part defining the mould cavity and a second mould part. The moulded product is removed from the mould cavity when the mouldable composition is substantially cured.
    Type: Application
    Filed: April 1, 2005
    Publication date: July 31, 2008
    Applicant: GPAC TECHNOLOGY (S) PTE LTD
    Inventors: Teck Tin Wong, Tee Jong Hui, Shin Huay Ong